Lead IC Packaging Architect - 3D/2.5D & Data Center
Nutanix
Qualcomm Technologies, Inc. is seeking a highly motivated Principal IC Packaging Engineer to lead the development of advanced integrated circuit (IC) packaging technologies. This role involves spearheading product introductions targeting Data Center AI and Power Management. The ideal candidate will have extensive experience in package technologies, manage relationships with assembly suppliers, and lead multi-disciplinary teams while resolving technical challenges. #J-18808-Ljbffr Nutanix
Vacancy posted 2 days ago
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