R&D Manager - Thermal Solutions

Description


• Lead formulation and optimization of polymer-based thermal interface materials (TIM1, TIM1.5, TIM2) and potting compounds for advanced semiconductor packaging. • Apply structure-property relationships to guide formulation strategy, performance trade-offs, and portfolio evolution. • Design and execute hypothesis-driven experimental programs linking polymer chemistry, fillers, and processing to thermal, mechanical, and reliability performance. • Generate high-quality data to support stage-gate decisions, technical risk assessment, and commercialization Build and evaluate package-level assemblies to assess material performance under realistic thermal, mechanical, and environmental conditions. • Support reliability testing and qualification for high thermal flux and mechanically constrained packaging environments. • Translate material-level results into package- and system-level performance implications. Customer & Market Engagement • Lead customer-facing technical engagement for thermal interface and potting materials in advanced semiconductor packaging. • Translate customer requirements into R&D priorities while maintaining a focus on technology leadership. • Partner with hyperscalers and contract manufacturers to accelerate adoption of next-generation thermal solutions in AI and data center applications. Cross-Functional Collaboration • Partner with Product Development, Manufacturing, and Marketing to ensure formulations are scalable, manufacturable, and aligned with portfolio strategy. • Support portfolio validation by providing data, samples, and technical documentation to enable design-in and qualification.

Additional Skills & Qualifications


7+ years of industry experience developing, formulating, or validating polymerbased materials for semiconductor packaging, electronics assembly, thermal interface materials, or other high-reliability applications. • Strong applied understanding of polymer chemistry, composite formulation, and additive systems, with the ability to link formulation design to thermomechanical performance. • Experience applying structure-property relationships to manage performance trade-offs across TIM1, TIM1.5, TIM2, and potting compound applications. Job Title: R&D Manager - Thermal Solutions Reports to: VP Marketing & Product Development Location: Westwood, MA • Working knowledge of PCB- and advanced-package-level thermal and mechanical environments, including processor packaging, lids/stiffeners, cold plates, and TIM selection and reliability considerations. Education • Bachelor's degree in Materials Science, Polymer Science, Chemical Engineering, Electrical Engineering, or a related discipline. Advanced degrees preferred.

Experience Level


Expert Level


Job Type & Location
This is a Permanent position based out of Westwood, MA.
Pay and Benefits
The pay range for this position is $150000.00 - $160000.00/yr.
Health, Vision, Dental, 401K
Workplace Type
This is a fully onsite position in Westwood,MA.
Application Deadline
This position is anticipated to close on Jun 9, 2026.
About Actalent


Actalent is a global leader in engineering and sciences services and talent solutions. We help visionary companies advance their engineering and science initiatives through access to specialized experts who drive scale, innovation and speed to market. With a network of almost 30,000 consultants and more than 4,500 clients across the U.S., Canada, Asia and Europe, Actalent serves many of the Fortune 500.


The company is an equal opportunity employer and will consider all applications without regard to race, sex, age, color, religion, national origin, veteran status, disability, sexual orientation, gender identity, genetic information or any characteristic protected by law.


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Use of Artificial Intelligence (AI): We may use Artificial Intelligence (AI) to support parts of our hiring process, including sourcing, screening, and evaluating candidates. AI helps assess applications and qualifications, but final decisions are made by our hiring team. By applying, you acknowledge and agree that your application may be reviewed using AI tools.