Packaging Module Development Engineer
$133.8k - $188.89kIntel
Job Details:Job Description: The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies.The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.Key Responsibilities Optimizes metrology capability across laboratory and manufacturing environments by developing and qualifying measurement processes, equipment specifications, calibration methods, and correlation techniques.Uses design of experiments, statistical analysis, and measurement system analysis to improve repeatability, reproducibility, and consistency across tools, sites, and product generations. Documents technical findings and improvements through white papers, reports, and qualification summaries.Establishes measurement specifications and collaborates with equipment suppliers, internal development teams, quality, process, and manufacturing organizations to ensure measurement capability, traceability, and data integrity meet program needs.Provides technical consultation on measurement challenges, equipment issues, lab-to-factory correlation, and metrology process improvements.Supports standardization of metrology methods, and works closely with packaging technology development, process engineering, and partner engineering groups to assess readiness and meet product milestones.Qualifications:You must possess the minimum education requirements and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.Minimum QualificationsBachelor's degree with 4+ years or Master's degree with 3+ years, or PhD with 1+ years of relevant experience in Electrical Engineering, Mechanical Engineering, Physics, Metrology, Instrumentation, Optical Engineering, or a related engineering discipline.1+ years of Hands-on experience in metrology systems development, measurement equipment qualification, calibration, and/or measurement method development in a manufacturing, lab, or engineering environment.2+ years of knowledge of measurement system analysis (MSA), including bias, linearity, stability, repeatability, and reproducibility.2+ years of experience with electrical measurements and test, such as continuity, resistance, leakage, signal integrity basics, or related parametric test methods.2+ year of experience with optical metrology, including microscopes, imaging systems, inspection methods, and/or machine vision.2+ years of working knowledge of data analysis tools such as Python, Excel, SQL, or similar tools for measurement analysis and reporting.Preferred QualificationsExperience in semiconductor manufacturing, preferably in advanced packaging.Experience developing or sustaining metrology systems for process control, product qualification, or reliability evaluation.Strong background in equipment selection, tool qualification, acceptance testing, and calibration traceability.Experience with machine vision systems, automated inspection, or camera-based measurement techniques.Familiarity with lab-to-factory correlation, tool matching, and cross-tool measurement agreement studies.Experience with DOE, correlation analysis, and method optimization for metrology or test systems.Knowledge of quality systems, measurement documentation, and standardization of metrology methods.Experience working with suppliers, vendors, or external calibration/measurement service providers.Demonstrated ability to analyze measurement data using statistical methods to identify variation, correlation issues, tool drift, and root causes.Join us at Intel to contribute to technological advancements while building a rewarding and impactful career. Apply now to be a part of our extraordinary journey.Job Type:Experienced HireShift:Shift 1 (United States of America)Primary Location: US, Arizona, PhoenixAdditional Locations:Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.SummaryLocation: US, Arizona, PhoenixType: Full time
$115.11k - $219.55k
...Details:Job Description: The Advanced Packaging Technology Manufacturing (APTM)... ...division at Intel is responsible for the development and commercialization of industry-... ...volume manufacturing.As a Packaging Module Development Engineer, you will:• Contribute to the advancement...SuggestedFull timeWork experience placementInternshipLocal areaImmediate startShift work$99.03k - $188.89k
...and do something wonderful.The Role and ImpactJoin Intel's Packaging Module Development team and play a pivotal role in pioneering assembly... ...'s future advancements. As a Packaging Module Development Engineer, you will develop innovative processes and refine equipment...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
...presence to fulfill essential job responsibilities.As an RF Module Development Engineer, you will be at the forefront of driving innovation and... ...customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our...SuggestedFull timeInternshipLocal areaImmediate startShift work$115.11k - $219.55k
Intel is seeking an RF Module Development Engineer based in Phoenix, Arizona. In this role, you will drive innovation in analog RF test and design... ...use of advanced lab equipment. A competitive compensation package includes an annual salary range of $115,110 - $219,550,...Suggested$133.8k - $188.89k
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- Talanto in the United States (Arizona, Phoenix) is seeking a Packaging Module Development Engineer in Laser Assembly to advance semiconductor packaging technologies. You will help develop laser packaging processes and equipment, impacting performance and reliability of...
$128.88k - $245.16k
...highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop,... ...including DRC, and density/fill modules. Industry experience with... ...semiconductor foundries, advanced packaging organizations (OSATs),...Full timeLocal areaImmediate startShift work$115.11k - $188.89k
...Details:Job Description: The Role and ImpactJoin Intel's Packaging Module Development team and play a critical role in shaping the future of assembly... ...packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and...Full timeInternshipLocal areaImmediate startShift work$89.01k - $170.63k
...Technology Fabrication (OTF) DSIRE (Diffusion) Module Engineer role is multifaceted. The ideal... ...include elements of module-level process development in support of the factory's goal and... ...ABenefitsWe offer a total compensation package that ranks among the best in the industry...Full timeInternshipLocal areaImmediate startShift workNight shiftDay shift$99.03k - $139.81k
...Details:Job Description: Assembly and Test Technology Development (ATTD) Microelectronic Packaging Engineers provide project management, package design/... ...able to coach and role model the correct execution of module operations.Clearly understand and communicate execution...Full timeLocal areaImmediate startShift work$89.01k - $170.63k
...in inline metrology will give engineers more data throughout the... ...Technology Fabrication (OTF) Module Engineer role is multifaceted... ...elements of module-level process development in support of the factory's goal... ...offer a total compensation package that ranks among the best in...Full timeWork experience placementInternshipLocal areaImmediate startFlexible hoursShift workNight shiftDay shift$85.2k - $162.5k
Job Details:Job Description: The Role and ImpactJoin Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the...Full timeInternshipLocal areaImmediate startShift work$248.4k - $350.69k
...customers worldwide. Our Manufacturing Development and Customer Engineering (MDCE) organization is at the... ...Key Responsibilities: Leads a team of module development engineers to drive technology... ...as logic technology development, packaging, silicon process technologies, or related...Full timeInternshipLocal areaImmediate startWorldwideShift work$85.2k - $139.81k
...support root cause determination of assembled package yield loss and in-line failures on a back of week compressed shift. The engineer on shift will be responsible for technical... ..., as well as shift 1 engineers and module partners, yield support, integration and program...Full timeLocal areaImmediate startShift workAfternoon shift$120.86k - $170.63k
...of technology with innovative solutions. As a Strategic/Development Industrial Engineer within the Foundry Capacity Optimization (FCO) organization... ...of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeLocal areaImmediate startShift work$155.52k - $298.44k
...Description: Join Intel and build a better tomorrow.Manufacturing Development Customer Engineering (MDCE) is Intel's newest organization within Intel... ...of TrustN/ABenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of...Full timeLocal areaImmediate startShift work- Intel Corporation's Advance Packaging Team in Phoenix is hiring a Manufacturing Technician within the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization. You will operate and maintain semiconductor manufacturing equipment, collect...Night shift
$116k - $159.5k
...global leader in materials science and engineering solutions that are at the foundation of... ...through Demos, on site evaluations and Joint Development ProgramsResolves complex tool issues... ...addition to a comprehensive benefits package, candidates may be eligible for other...Full time$48.51k - $66.7k
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...below. Life at IntelPosition Summary: The Semiconductor Packaging Research Engineer drives technology research for advanced packaging and heterogeneous... ...through reports, design guidance, IP, publications, and development-transfer inputs. Collaborate across research, design,...Full timeInternshipLocal areaImmediate startShift work$105.65k - $200.34k
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...Laboratory is seeking a motivated, hands-on engineer to join our Environmental Stress Tool... ...in advancing Intel's next-generation packaging technologies, including EMIB, Foveros,... ...supporting package qualification and technology development efforts. Our team develops, operates,...Full timeLocal areaImmediate startShift work- ...Use your experience and scientific knowledge to lead technical development activities. Help drive growth as a technology expert through... ...and development efforts. Qualifications Bachelor’s Degree in Engineering (required). Desired Skills Industrial design talent. Ability...
$19 per hour
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...Description: Become a part of Intel's Advance Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA)... ...maintain system reliability. Work closely with Module Engineering to execute experiments, implement equipment...Hourly payPart timeLocal areaImmediate startShift workNight shift3 days per week- ..., we do great things.Who You Are: The Director of Electrical Engineering is a senior leadership role responsible for overseeing and managing... ...design, standards, and execution across mission‑critical development projects. This role plays a critical part in delivering...Full timeWork at office
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