R&D Engineer III - Advanced Memory

R&D Engineer III - Advanced Memory Intern Full-Time Professional Boise, ID, US 4 days ago Requisition ID: 1932 For more than 50 years, Photronics has been a global leader in photomask technology, powering the innovation behind the world’s most advanced devices. Our success is built on collaboration, quality, and the dedication of our people. Location On‑site in Photronics Boise Idaho office. We are not open to remote candidates at this time. Travel Less than 15% to support customer meetings, supplier interactions, training, or cross‑site collaboration. Willingness to work off‑hours in support of critical customer and development needs. Responsibilities Drive continuous improvement initiatives focused on defect reduction, cycle time improvement, yield enhancement, and cost reduction. Troubleshoot complex process, lithography, and equipment‑related issues within a high‑volume semiconductor manufacturing environment. Lead and participate in cross‑functional and multi‑site technical projects to improve process capability and operational performance. Support customer‑facing development projects and drive issue resolution through data‑driven analysis and effective communication. Prepare technical reports, presentations, process documentation, and engineering summaries. Support technology transfer activities from R&D into high‑volume manufacturing. Mentor junior engineers and technicians as needed. Additional responsibilities as assigned. Qualifications Results‑oriented with a strong sense of ownership, accountability, and urgency. Ability to remain effective and focused in a fast‑paced, multi‑tasking environment. Strong organizational and prioritization skills with the ability to manage multiple projects and meet aggressive timelines. Excellent analytical, problem‑solving, communication, and interpersonal skills. Ability to exercise sound engineering judgment in selecting methods, techniques, and evaluation criteria to achieve optimal results. Strong understanding of photomask or wafer memory manufacturing processes. Ability to drive projects and influence cross‑functional teams, including coordination across multiple sites. Understanding of semiconductor technology roadmaps and advanced process development requirements. Ability to work independently while effectively collaborating within highly technical teams. 6–8+ years of related experience in semiconductor or photomask manufacturing, process development, or advanced R&D Engineering. Experience in advanced memory technology processes and/or designs. Experience analyzing complex technical issues requiring in-depth evaluation of multiple process variables and design interactions. Experience in mask or wafer lithography, metrology, OPC design, or related semiconductor technologies. Experience leading and/or participating in highly technical teams to resolve process, lithography, or pattern design challenges. Experience supporting customer‑facing development projects and driving technical issue resolution to closure. Education BS or MS degree in Engineering, Physics, Chemistry, Materials Science, or related technical discipline required. Equal Opportunity Statement: We are committed to equal employment opportunity regardless of race, color, ancestry, religion, sex, national origin, sexual orientation, age, citizenship, marital status, disability, gender, gender identity or expression, or veteran status. We are proud to be an equal opportunity workplace. We are committed to providing reasonable accommodation for team members’ disabilities and religious beliefs or practices. #J-18808-Ljbffr