Mechanical Advanced Packaging Engineer

Mechanical Advanced Packaging Engineer Job ID: 2617660 Location: Crane, IN, United States Date Posted: Oct 12, 2026 Category: Engineering and Sciences Subcategory: Mechanical Engr Schedule: Full-Time Shift: Day Job Travel: No Minimum Clearance Required: Interim Secret Clearance Level Must Be Able to Obtain: Secret Potential for Remote Work: Hybrid Job Description Description SAIC is seeking a talented and motivated Advanced Packaging Engineer to support cutting-edge missile system hardware design and analysis efforts. In this role, you will collaborate with multidisciplinary engineering teams to develop, analyze, and validate advanced microelectronics packaging solutions for complex defense systems. This position offers a hybrid work schedule; however, candidates must reside within commuting distance of Crane, IN.

JOB RESPONSIBILITIES:

Support mechanical design and analysis of missile system hardware and microelectronics packaging and assembly Perform mechanical modeling and simulation activities, including finite element analysis (FEA), thermal fatigue, shock and vibration analysis, and MATLAB-based modeling Apply systems engineering principles throughout all stages of the product lifecycle, including requirement development, verification, and validation Participate in and support Systems Engineering Technical Reviews, including System Requirements Reviews (SRR), Preliminary Design Reviews (PDR), Critical Design Reviews (CDR), and Production Readiness Reviews (PRR) Collaborate with design teams to facilitate and document design development activities Support Technical Interchange Meetings (TIMs) and contribute to cross-functional team discussions Analyze solder interconnect technologies, including Ball Grid Array (BGA), Column Grid Array (CGA), Flip-Chip, and J-lead packages Conduct experimental test and evaluation activities, including solder fatigue analysis and material property evaluations Clearly communicate technical findings, analyses, and recommendations to a wide range of audiences, including both technical and non-technical stakeholders Qualifications

REQUIRED EDUCATION AND EXPERIENCE:

Bachelor’s degree in mechanical or aerospace engineering 5+ years’ experience with mechanical modeling and simulation (e.g., FEA/ANSYS, MATLAB, vibration, shock, thermal fatigue) Experience with or knowledge of systems engineering principles Interim secret clearance is required to start with the ability to obtain a secret clearance. SAIC will sponsor the clearance process Must be a US citizen

PREFERRED EXPERIENCE:

Experience with missile system hardware design and analysis Familiarity with microelectronics packaging and assembly, including solder interconnect technologies Overview SAIC accepts applications on an ongoing basis and there is no deadline. SAIC® is a premier mission integrator focused on advancing the power of technology and innovation to serve and protect our world. Our robust portfolio of offerings across the defense, space, intelligence, and civilian markets includes secure high-end solutions in mission IT, enterprise IT, engineering services, and professional services. We integrate emerging technology, rapidly and securely, into mission critical operations that modernize and enable critical national imperatives. We are approximately 23,000 strong; driven by mission, united by purpose, and inspired by opportunities. SAIC is an Equal Opportunity Employer. Headquartered in Reston, Virginia, SAIC has annual revenues of approximately $7.3 billion. For more information, visit saic.com. For ongoing news, please visit newsroom. #J-18808-Ljbffr SAIC