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Thermo-Mechanical CFD Intern: CoWoS IC Packaging

Etched.ai, Inc.

Etched.ai, Inc. in San Jose is seeking a Thermo-Mechanical, CFD Simulation Engineering Intern for a 12-week paid internship. The role focuses on Chip-on-Wafer-on-Substrate package development, utilizing tools like ANSYS Mechanical APDL and ANSYS FLUENT for critical analysis. Ideal candidates are pursuing a degree in Mechanical Engineering and possess academic experience with FEA/CFD tools. The program offers mentorship and generous housing support for interns relocating to the area. #J-18808-Ljbffr Etched.ai, Inc.

Vacancy posted 1 day ago
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