Packaging Engineer - Focal Plane Array

Job Description FPA Packaging Engineer - Cutting-Edge Technology + Excellent Benefits and Growth! Salary: $100,000 - $150,000 per year A bit about us: Based in Ventura County, we are an established high‑tech infrared, laser, and sensors company. Our core values are centered around our people and clients. We believe that putting your employees first gives a competitive edge to ensure clients have an excellent experience. Over the years, our reputation for providing our people with the very best has caught the eye of some reputable clients who have chosen to use us as their primary firm. Why join us? Meaningful Work! Best in Class Firm! Competitive Compensation Package! Complete Benefits Package! Flexible Work Schedules! 401k Matching! Accelerated Career Growth! Fun Company Activities! Many More! Job Details We are seeking a highly skilled and motivated Packaging Engineer with a focus on Focal Plane Array (FPA) to join our dynamic team in the technology industry. The successful candidate will be involved in the development and execution of innovative packaging solutions for semiconductor wafer and die. This role provides an excellent opportunity to apply your skills in a challenging and rewarding environment, where you will be integral in shaping the future of technology. Responsibilities: Developing and implementing advanced packaging processes for wafer and die, including die attach and die bonding. Collaborating with design, process, and reliability engineering teams to ensure the successful integration of FPAs into product packages. Performing detailed analysis and characterization of packaging materials and processes to ensure optimal performance. Designing and executing experiments to validate new packaging concepts and technologies. Developing and implementing inspection and testing procedures to ensure the quality and reliability of packaged FPAs. Driving continuous improvement initiatives to enhance packaging efficiency, yield, and cost-effectiveness. Troubleshooting packaging-related issues and implementing effective solutions. Staying up to date with the latest trends and advancements in packaging technology and incorporating them into our processes. Qualifications: A bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field. A master's degree or Ph.D. is preferred. A minimum of 3 years of experience in semiconductor packaging, with a focus on FPA. Proficiency in wafer and die packaging processes, including die attach and die bonding. Experience with IR technology and flip‑chip hybridization processes. Strong knowledge of semiconductor materials and their properties. Excellent problem‑solving skills and the ability to troubleshoot complex packaging issues. Strong communication and teamwork skills, with the ability to work effectively in a cross‑functional team. The ability to manage multiple projects simultaneously and meet tight deadlines. A strong commitment to quality and continuous improvement. We offer a unique opportunity to work with a team of talented engineers and contribute to the development of cutting‑edge technology. If you are a passionate and dedicated professional with the required experience and skills, we encourage you to apply. #J-18808-Ljbffr 6AM City, LLC