Senior Co-Design Architect: Power, Thermal & Packaging
Jobleads-US
NVIDIA's Silicon Co-Design Group seeks a senior Co-Design Architect to push the physical limits of chips, spanning architecture, silicon, systems and manufacturing. You won't maintain existing solutions; you'll redefine what's possible and shape GPU/CPU outcomes at scale.
In this role you will identify where power, thermal and packaging constraints will erode competitiveness, and build cross‑domain, testable solutions that deliver next‑generation performance.
#J-18808-Ljbffr Jobleads-USVacancy posted 3 days ago
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