Foundry Customer Integration Engineer

Overview Join Customer Engineering and play a pivotal role in Intel’s transition from IDM to Foundry. Customer Engineering is an integral part of MDCE (Manufacturing Development and Customer Engineering) which is responsible for both improving yield and performance on high volume manufacturing technologies and supporting all Intel’s customers. Customer Engineering works with our foundry customers to ensure they receive world class service. This job requisition seeks a fab integration Customer Engineering role in the MDCE Customer Engineering organization, reporting to a Customer Engineering manager. Selected candidates will work closely with internal teams and external customers to ensure seamless technology integration and customer satisfaction. Responsibilities Identify recurring patterns and learnings from customer engagements, abstract them into foundry standards, systemise, automate and proliferate them across other technologies and customers. Be the DRI (Directly Responsible Individual) to support customer improvement projects and respond to process issues on behalf of the customer, including regular communication with the customer and from the customer to the factory, serving as the single point of contact for FEOL and/or BEOL process integration issues. Collaborate with Technology Development team to import new technology to Customer Products. Work with FEOL/BEOL Integration, Device, Defect Reduction and Yield Analysis team members to identify root cause of yield/performance issues and implement mitigation plan within a defined timeline to meet committed production yield/performance targets and support fast paced yield ramp‑up in high‑volume manufacturing phases. Own engineering projects to improve product yield, quality, performance and to reduce wafer cost. Candidate Skills Problem‑solving technique with strong self‑initiative and self‑learning capabilities, comfortable working with a high degree of autonomy. Experience working with multi‑functional, multi‑cultural teams. Highly organised and able to identify patterns from customer‑specific issues, abstract key learnings, and systemise and proliferate best practices across teams and technologies. Excellent communications skills and the ability to distil complex information into easily understandable messages. High degree of ownership for problems with a high tolerance for ambiguity. Interpersonal skills including influencing, engaging, and motivating. Minimum Qualifications Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related STEM field; advanced degree preferred. 10+ years’ experience in advanced node semiconductor industry in FEOL and/or BEOL Process Integration. 10+ years’ experience in advanced node semiconductor development or high‑volume manufacturing. Preferred Qualifications Advanced degree (Master's or Ph.D.) in Electrical Engineering, Physics or Materials Science; other related science and engineering degrees considered based on industry experience. 7+ years of experience collaborating with module processes including lithography, dry etch, wet etch, CMP, thin films and metrology. 7+ years of applied industrial experience in semiconductor process integration, device physics, logic, architecture and integration, and interconnect development on leading‑edge technology nodes. 7+ years of strong project management skills with ability to manage timelines, risks, and deliverables across multiple stakeholders. Experience with 7nm‑16nm FinFET, Process Design Kit (PDK) silicon model target generation and use, silicon‑to‑simulation correlation, test structure design, device modeling and electrical characterization. Job Type & Location Experienced Hire – Shift 1 (United States of America) – Primary Location: US, Arizona, Phoenix. Additional Locations: (details omitted). Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range $140,830.00 – 198,820.00 USD (range for jobs performed in the US; individual pay determined by location and experience). Work Model This role will be eligible for the hybrid work model, allowing employees to split their time between working on‑site at the assigned Intel site and off‑site. Hiring Practices Intel is committed to Responsible Business Alliance compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. #J-18808-Ljbffr Intel Corporation