Foundry Services Advanced Packaging Account Technical Solutions Engineer

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting‑edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry‑leading technology, a rich IP portfolio, a world‑class design ecosystem, and an operationally resilient global manufacturing supply chain. Key Responsibilities Own the end‑to‑end customer relationship as the primary interface between the customer and Intel, ensuring seamless communication, trust, and alignment across all phases of engagement. Work directly with customer to understand packaging challenges and requirements and provide technical consultation on packaging solutions and processes. Engage expert stakeholders across Intel Foundry to ensure customers have firsthand access to information. Collaborate with cross‑functional teams including Technology Development, Product Engineering, Manufacturing and Operations, and Customer Engineering teams providing feedback to influence product and technology roadmaps. Lead and coordinate all internal Intel interactions related to the customer account to drive commitment to execution across schedule, quality, technical execution, qualification and volume ramp. Develop and maintain the Statement of Work (SOW) documenting customer requirements, Intel Foundry commitments, technical deliverables, and schedule milestones. Manage full customer engagement lifecycle from initial design award through development, ramp, high volume manufacturing (HVM), and end of life. Track and drive closure of customer commitment, action items and escalations. Monitor milestones, risks, dependencies and change requests. Drive resolution of issues affecting qualification and delivery. Provide clear status reports to both customers and leadership. Serve as the Voice of the Customer inside Intel Foundry, ensuring customer priorities, risks, and expectations are clearly communicated and advocated across all internal functions. Required Skills and Experience Experience in Semiconductor Packaging Strong communication, project management and customer‑facing skills Ability to operate across both technical and operations discussions Problem‑solving and analytical thinking Ability to explain complex technical concepts clearly Willingness to travel Bachelor's or Master's Degree in Electrical Engineering, Materials Science, Mechanical Engineering or Chemical Engineering or related field. 10+ years industry experience 5+ years in Semiconductor Packaging, Assembly / Test or Backend Manufacturing, Operations, Product Engineering, Field Applications or customer‑facing engineering Preferred Skills and Experience Strong communication, project management and customer‑facing skills Ability to operate across both technical and operations discussions Problem‑solving and analytical thinking Ability to explain complex technical concepts clearly Willingness to travel Job Information Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: US, California, Folsom; US, California, Santa Clara; US, Oregon, Hillsboro; US, Texas, Austin Posting Statement All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This is a Position of Trust. Consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your recruiter. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Annual Salary Range $220,320.00 – $311,040.00 USD Work Model This role will require an on‑site presence. #J-18808-Ljbffr Intel Corporation