Principal Design Engineer, HBM
1000 Micron Technology, Inc.
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a Principal HBM Design Engineer, you will lead cross‑functional efforts to drive silicon debug, product quality, and system‑level stability for high‑volume HBM products. You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of design, silicon, and system behavior, providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long‑term maintainability. Technical Leadership: Define debug strategies, guide cross‑functional teams, and serve as a technical authority in HBM sustaining efforts. Silicon & System Debug: Lead root‑cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple domains. Cross-Functional Execution: Drive alignment and execution across DE, PE, TD, and system teams to ensure efficient issue resolution and product delivery. Quality & Yield Leadership: Identify systemic issues and lead initiatives to improve yield, reliability, and performance across HBM products. Customer Impact: Lead critical customer escalations and system bring‑up support, ensuring timely resolution and high customer satisfaction. Forward Influence: Drive feedback into architecture, design, and verification methodologies to improve future HBM product quality and robustness. Qualifications 8+ years (BS) or 6+ years (MS) in Electrical/Computer Engineering or related field Deep expertise in HBM/DRAM architecture and high-speed memory interfaces Strong experience in silicon debug, system-level analysis, and root-cause resolution Proven ability to lead complex technical problems across cross‑functional teams Strong background in digital and/or custom design and verification Preferred Qualifications Demonstrated ownership of complex silicon/system issues impacting product or customer delivery Experience influencing architecture, design trade-offs, or product decisions Deep understanding of: Timing, margining, SI/PI, System-level behavior and silicon correlation Experience with DFT, mBIST, and test-mode debug Strong scripting/automation skills (Python) Excellent communication skills with ability to drive alignment at senior technical levels Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. Micron prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc. #J-18808-Ljbffr 1000 Micron Technology, Inc.
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- Responsibilities Design Ownership: Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification... ...8+ years (BS) or 6+ years (MS) in Electrical/Computer Engineering or related field. Deep expertise in HBM/DRAM architecture...SuggestedLocal area
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- ...architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g.... ...Preferred Qualifications Experience with HBM / DRAM adjacent SoC designs, or memory‑... ...Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field...Local areaRelocationNight shift
$146k - $309k
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- ...subsystems, including high‑bandwidth memory (HBM) channel support logic, boot and... ...synthesizable register‑transfer level (RTL) designs in SystemVerilog, including multi‑channel... ...handle corner cases, and maintain clear engineering change order (ECO) pathways. Collaborate...Local area
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$146k - $297k
Micron Technology in Richardson, Texas is searching for a SoC Design Engineer to join their Heterogeneous Integration Group (HIG). The role involves designing and integrating next-generation HBM SoC logic die while collaborating with various teams to implement high-performance...- ...architect and optimize circuitry for next-gen HBM products. This role requires a Bachelor's degree in Electrical Engineering or a related field along with 4 years of industry... .... The candidate will coordinate subsystem design, determine specifications, and enhance performance...
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- 1000 Micron Technology, Inc. is seeking a SoC Design Engineer to join the Heterogeneous Integration Group in Richardson, Texas. In this role... ...will contribute to the design and integration of next-generation HBM SoC logic die, collaborating with various teams to implement...
- Micron in Richardson, Texas is seeking a SoC Design Engineer to contribute to the design and integration of next-generation HBM SoC logic die. You will collaborate with cross-functional teams to implement high-performance solutions meeting power and performance targets...
- ## HBM SoC Physical Design EngineerRichardson, Texas, United States of AmericaApply NowFind out how well you match with this jobJob IDJR103414... ...communicate and advance faster than ever.As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will...Local areaNight shift
$146k - $297k
Micron Technology, Inc. is looking for a SoC Design Engineer in Richardson, Texas. In this role, you will design and implement RTL for HBM logic die, collaborating with various teams to ensure robust solutions. A minimum of 10 years in the field, along with a relevant degree...- Micron Technology, Inc in Richardson, Texas is seeking a qualified HBM SoC Physical Design Engineer. This role involves owning the implementation of advanced HBM SoC logic designs, with key responsibilities including physical optimization and timing closure. The successful...
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- ...ever. As part of the High Bandwidth Memory (HBM) team, this role supports the development... .... The team collaborates across design, verification, packaging, and test to enable... ...successful silicon bring‑up. The Analog Design Engineer contributes to the design, simulation,...InternshipLocal area
- ...000 Micron Technology, Inc. in Richardson, Texas is looking for a SoC Design Engineer within the Heterogeneous Integration Group. The role involves designing, developing, and integrating advanced HBM SoC logic die. The ideal candidate should have a strong background in...
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