Principal ASIC Package Design Engineer: FC-BGA & MCM Lead
K2 Space
K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging for high-performance mixed-signal and digital SoCs. You will drive end-to-end package strategy, engage with vendors, and define standards to ensure first-pass success for power-dense ASICs. Join a fast-growing, Series D-funded space tech company with a hybrid in-office requirement (3 days/week) and travel to our Torrance, CA HQ. #J-18808-Ljbffr K2 Space
Vacancy posted 1 day ago
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Seattle, WA1 day ago
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