Packaging Substrate Engineer
$126.8k - $220.9kApple Inc.
San Francisco Bay Area, California, United States Hardware Our Hardware Technology Packaging team invents, designs, develops, and integrates electronic packaging solutions for Apple’s internal and custom external components of hardware for its consumer electronic products such as iPhone, iPad, Mac, Apple Watch, Apple TV etc. In this highly visible role, you will own and drive sophisticated package selection, new-generation package structure and configuration optimization. You will be responsible for Apple package substrate including design, technology, manufacturing, and reliability, and future roadmap; and work with cross-functional teams to achieve the best package performance. Description Lead SoC package substrate technology development, pathfinding, and roadmap definition. Work with substrate manufacturing industry, foundry, and OSAT to bring package substrate solution from concept to HVM. Drive industry with sophisticated package solutions, new architecture, material and process development, and spec definitions. 5% International travel Responsibilities Work with industry partners to develop new substrate technologies from concept to HVM for Apple packaging roadmap. Work with cross-functional groups to define & optimize new package substrate architectures based on performance, technical risk, cost, and availability etc. Problem solving of technical issues during the full product development cycle. Minimum Qualifications Minimum requirement of a bachelors degree Preferred Qualifications MS and or Ph.D. and 3+ years of relevant industry experience. In-depth knowledge of substrate technology, manufacturing process, design rules, and roadmap. Hands-on experience in substrate manufacturing and technology development: Cu plating, lithography, dielectric material, via formation, solder resist, surface finish etc. Familiarity with package assembly and integration process preferred. Experience in Cadence Allegro platform tools and design review for manufacturing (DFM). Exceptional technology development & project management skills. At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $126,800 and $220,900, and your base pay will depend on your skills, qualifications, experience, and location. Apple employees also have the opportunity to become an Apple shareholder through participation in Apple’s discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple’s Employee Stock Purchase Plan. You’ll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses — including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits. Apple is an equal opportunity employer that is committed to inclusion and diversity. We seek to promote equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics. Learn more about your EEO rights as an applicant. #J-18808-Ljbffr Apple Inc.
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...result? We are looking for a hardworking and passionate IC Packaging Assembly Engineer to join our team. In this highly visible role, you will... ...collaboration with quality, reliability, and FA teams. Partner with substrate and package design teams to provide DFM input on pad/bump...SuggestedRelocationOverseas- A hardware startup in San Francisco is hiring a Semiconductor Packaging Engineering Intern for a fall internship. Interns will engage in hands-on engineering tasks including device fabrication, prototyping, and working with advanced packaging technologies. A portfolio showcasing...SuggestedHourly payInternship
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A Family Company in San Francisco is seeking a Sr. Associate, Packaging Engineer to innovate packaging solutions for consumer brands. The role requires a Bachelor's degree in packaging or engineering, with at least 3 years of experience in product development. The candidate...$126.8k - $220.9k
Apple Inc. is seeking an IC Packaging Engineer in San Francisco to drive the mechanical and material evaluation of cutting-edge Integrated Circuit packages. The role involves designing tests, leading evaluations of advanced materials, and developing methodologies to solve...- ...are a decentralized, non-hierarchical team seeking an expert Substrate and Rust Developer (experience building on Polkadot is a plus)... ...contract scripting system, and numerous other protocols. As an engineer on the Analog team, you’ll be redefining the legacy blockchain...Contract workRemote workFlexible hours
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