Lead IC Packaging Engineer - FCBGA & NPI
Apple Inc.
A leading technology firm in California is seeking an experienced IC Packaging Assembly Engineer to optimize flip-chip BGA assembly processes. The role involves leading packaging technology development and working with cross-functional teams. Candidates must have over 10 years of experience in semiconductor packaging, a strong engineering background, and excellent problem-solving skills. The position offers competitive compensation and comprehensive benefits, fostering growth within the company. #J-18808-Ljbffr Apple Inc.
Vacancy posted 5 days ago
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