Senior IC Package Design Engineer — SoC & SiP Innovation
$126.8k - $220.9kApple Inc.
Apple Inc. in San Francisco is seeking a Package Design Engineer to lead the design and integration of advanced semiconductor packages across various technologies. This role involves optimizing package architecture, driving collaboration with cross-functional teams, and enhancing design methodologies through automation. Applicants should have a strong background in IC package design and experience with advanced simulation tools. The position offers a range between $126,800 and $220,900, alongside comprehensive benefits including stock options and medical coverage. #J-18808-Ljbffr Apple Inc.
Vacancy posted 3 days ago
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