Marketing Programs Manager: 3D IC & Advanced Packaging

Overview Job Title: Marketing Programs Manager – 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location: Wilsonville, OR; Santa Clara, CA; or Boulder, CO Siemens EDA is a global technology leader in Electronic Design Automation software. Our software tools enable companies around the world to develop highly innovative electronic products faster and more cost-effectively. Our customers use our tools to push the boundaries of technology and physics to deliver better products in the increasingly complex world of chip, board, and system design. Key Responsibilities Strategic Planning & Leadership for 3D IC/Advanced Packaging: Architect comprehensive, data-driven marketing strategies tailored to Siemens EDA's 3D IC design, multi-die integration, and advanced packaging solutions, aligning with growth initiatives and market positioning. Identify emerging platforms, industry trends (e.g., chiplets, wafer-on-wafer, hybrid bonding), and innovative approaches to maximize Siemens EDA's market visibility and competitive differentiation in this specialized area. Articulate the value proposition of Siemens EDA's solutions for addressing critical 3D IC challenges such as thermal management, power delivery, signal integrity, co-design, and verification. Campaign Management & Execution: Orchestrate integrated, multi-channel marketing campaigns that deliver measurable business outcomes for our 3D IC and advanced packaging offerings. Ensure consistent brand messaging and visual identity across all marketing assets and touchpoints, highlighting Siemens EDA's expertise in heterogeneous integration. Direct external agencies and vendors to deliver high-quality, on-brand campaign elements, potentially including technical white papers, application notes, and webinars focused on 3D IC methodologies. Cross-functional Collaboration: Partner closely with product management, R&D, sales, and executive leadership to align marketing initiatives with business objectives for our 3D IC and advanced packaging portfolio. Build strong stakeholder relationships across the organization to drive marketing integration and effectiveness, particularly with teams focused on physical verification, design for test (DFT), and system-level analysis for 3D ICs. Performance Measurement & Optimization: Establish key performance indicators (KPIs) to measure campaign effectiveness and return on investment for 3D IC-focused marketing initiatives. Continuously refine marketing approaches based on performance data and market feedback, adapting to the rapid evolution of 3D IC and advanced packaging technologies. Monitor competitor activities and market trends in the 3D IC and advanced packaging space to inform strategic marketing decisions. Required Qualifications Bachelor’s degree in Marketing, Business Administration, Electrical Engineering, Computer Engineering, or a related technical field. Deep understanding and passion for 3D IC design, heterogeneous integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan-out), and the associated EDA challenges (e.g., thermal, power, reliability, co-design). Outstanding communication and presentation skills with the ability to influence at all organizational levels, including technical experts and executive leadership. Strong analytical skills with experience in marketing metrics analysis and performance optimization. Willingness to travel domestically and internationally (approximately 20%). #J-18808-Ljbffr