Director of Advanced 2.5D/3D Packaging & Partnerships
$200.55k - $322.25kMediaTek Research Lab Inc.
MediaTek Research Lab Inc. is seeking a visionary manager or director for Advanced Packaging Development in San Jose, California. In this key role, you will lead the development of cutting-edge 2.5D and 3D packaging solutions for various business units. Responsibilities include collaborating with cross-functional teams and managing supplier relationships to ensure high-quality manufacturing processes. The ideal candidate will possess over 5 years of management experience in packaging, deep technical expertise in advanced packaging technologies, and strong supply chain management capabilities. A competitive salary of $200,550-$322,250 along with a bonus and benefits package is offered. #J-18808-Ljbffr
- ...MediaTek is seeking a visionary manager or director for Advanced Packaging Development in San Jose, California. In this strategic role, you will lead the development of cutting-edge 2.5D/3D packaging solutions essential for our Automotive and Computing business units....Partnership3D
- ...Senior Packaging Engineer – Advanced Materials & Thermal Integration Location: San Jose, CA Company: Destination 2D Inc. Destination 2D is pioneering CMOS-compatible graphene technologies that are redefining semiconductor performance—from beyond-copper interconnects to...3D
$152.5k - $244k
...experienced engineer to join our team researching advanced defect modeling, testing, screening, and... ...-generation semiconductor processes and 3D packaging technologies. The role is strategically... ...the functionality and yield of advanced 2.5D/3D packaging technologies. Key...3DVisa sponsorship- ...semiconductor foundry is seeking an experienced professional in advanced packaging technology to join their Field Technical Solutions team in... ...customers and leading technical solutions in cutting-edge 2.5D/3D packaging. Ideal candidates will have a Master's degree and...3D
- ...Design Kit) Development Engineer to lead the creation, integration, and validation of design enablement infrastructure for 2.5D/3D advanced packaging , including chiplet-based architectures, silicon interposers, and heterogeneous integration technologies. This role is...3DFull time
$168.8k - $241.2k
...the Team Cisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging... ...environment. This includes close partnerships with design engineering, operations, and... ...packaging technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various...Partnership3DFull timeContract workTemporary workLocal areaFlexible hours$2,000 per month
...accelerator platform across silicon, package, and board. The ideal... ...speed signaling solutions in advanced packaging. You will work closely... ...and optimization within 2D/2.5D/3D packages Close interaction... ...through final freeze in partnership with package layout, ASIC PD,...Partnership3DWork at officeRelocation package$250k - $375k
...alignment through tape‑out, KGD testing, packaging, and volume shipment milestones. Ensure... ...technical and business teams. Identify and advance risks early; propose and implement... ...advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer‑based...3D$123.5k - $180.5k
...semiconductor customers focused on advanced computing and high-... ...execution, and align foundry and packaging capabilities with customer roadmaps... ...and strong cross-functional partnership. Responsibilities... ...support customer innovation with 3D IC technologies and optimal manufacturing...Partnership3DContract work- ...Program Manager to own and drive complex silicon tapeouts, advanced packaging, bring-up, validation, and system-level integration programs... ...integration. Experience with advanced packaging technologies (2.5D/3D integration, chiplets, silicon photonics packaging, etc.)....3D
$180k - $301k
...MediaTek Research Lab Inc. in San Jose is seeking a visionary memory packaging technical leader for their Advanced Packaging Development team. You will lead the development of innovative 2.5D/3D packaging solutions that are vital for multiple business units. The ideal...3D$250k - $375k
...alignment through tape-out, KGD testing, packaging, and volume shipment milestones... ...semiconductor, custom silicon, or chiplet/advanced packaging environments ~ Direct experience... ...advanced packaging formats: CoWoS, InFO, 2.5D/3D integration, substrate/interposer-based...3DRemote workShift work$171k - $272k
...MediaTek is seeking a technical leader with expertise in Packaging Architecture, specifically in 2.5D/3D/3.5D technologies. This role requires collaboration... ...external partners. Extensive hands-on experience in advanced semiconductor packaging is essential. Salary range: $...3D- ...MediaTek is looking for a talented technical leader in San Jose, CA, focusing on advanced packaging technologies (2.5D/3D). This role will involve collaboration with cross-functional teams to develop innovative packaging solutions for automotive and datacenter applications...3D
- ...Mitigation: Proactively identify technical bottlenecks in advanced nodes (2nm/4nm) and implement contingency plans to avoid... ...power, performance, area (PPA) trade-offs, and advanced packaging requirements (2.5D/3D, HBM, Chiplets). • Financial Oversight: Manage project...3DFull timeLocal area
$171k - $272k
...MediaTek Research Lab Inc. in San Jose is looking for an experienced Packaging Architect specializing in advanced semiconductor packaging technologies like 2.5D/3D/3.5D. This position involves collaboration with various teams to develop innovative packaging solutions...3D- ...Overview Job Title: Marketing Programs Manager – 3D IC Design & Advanced Packaging Solutions Job Reference #: 506118 Job Location: Wilsonville, OR; Santa... ...integration, advanced packaging technologies (e.g., 2.5D, chiplets, fan-out), and the associated EDA challenges...3D
- ...The Product Line Manager (PLM) Director for Advanced Packaging & Metrology will drive product strategy, lifecycle management, and market analysis... ...packaging manufacturing processes and equipment (including 2.5D/3D packaging, hybrid bonding, chiplet architectures, fan-out...3DImmediate start
$129.34k - $161.09k
...orchestrator of the account, in close partnership with Business Development (BD) and... ...wallet across TIMs, heat spreaders, and advanced packaging solutions 2. 3-in-a-Box Leadership &... ...platforms Advanced packaging (2.5D/3D, chiplets, HBM) Thermal management...Partnership3DPermanent employmentFull timeContract workTemporary workWork experience placementWorldwideRelocation packageFlexible hours$133.5k - $183.5k
...solutions used to produce virtually every new chip and advanced display in the world. The role focuses on leadership... ...& Expertise Apply in-depth knowledge of advanced packaging inflections including logic (2.5D/3D integration, chiplets, hybrid bonding), DRAM (HBM, TSV...3DFull timeRelocation$180k - $250k
...Job Description MediaTek is seeking a talented and experienced technical leader with expertise in advanced packaging technologies, specifically 2.5D/3D. This role involves close collaboration with cross-functional teams, including IP, ASIC Design, Package Design, Signal...3DTemporary work- ...balancing platform needs, advanced imaging opportunities,... ..., development, or partnership exploration Qualifications... ...visualization; 3D stereoscopic visualization... ...(note: typically adds 2 weeks to the hiring process... ...compensation packages, inclusive of base pay,...Partnership3DLocal areaWorldwideFlexible hours
- ...computing. We are seeking an experienced IC Package Mechanical FEA Engineer to help drive... ...‑performance packaging solutions for advanced ASICs. In this role, you will join a globally... ..., including flip‑chip, FOWLP, 2.5D/3D integration, chiplet architectures, and...3DLocal area
$133.5k - $183.5k
...: Program Manager – Advanced Packaging (E4)Skip to main contentThis site uses cookies to maintain your user session. The cookies have no personal... ...of **advanced packaging inflections** including: - Logic (2.5D/3D integration, chiplets, hybrid bonding) - DRAM (HBM, TSV-...3DFull timeRelocation$138k - $190k
...Advanced Packaging Integration Engineer page is loaded## Advanced Packaging Integration Engineerlocations... ...innovative advanced packaging and 3D integration solutions.As an **Advanced Packaging... ...bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill,...3DFull timeWork at officeRelocation$174k - $239.5k
...to produce virtually every new chip and advanced display in the world. We design, build and... ...a subject-matter expert in **Advanced Packaging**. This role sits at the intersection of... ...with **Advanced Packaging** trends (e.g., 2.5D/3D-IC, FOWLP, fan-out/fan-in, advanced...3DFull timeRelocation$133.5k - $183.5k
...solutions used to produce virtually every new chip and advanced display in the world. We design, build and service... ...Expertise Apply in-depth knowledge of advanced packaging inflections including: Logic (2.5D/3D integration, chiplets, hybrid bonding) DRAM (HBM,...3DFull timeRelocation$210.9k - $369.1k
...reticles, integrated circuits, packaging, printed circuit boards and... ...innovative ideas and devices that are advancing humanity all begin with... ...Product Line Manager (PLM) Director for Advanced Packaging &... ...technology inflections (e.g., 2.5D/3D integration, hybrid bonding,...3DMinimum wageWork experience placementFlexible hours$210.9k - $369.1k
...wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel... ...The innovative ideas and devices that are advancing humanity all begin with inspiration,... ...trends and technology inflections (e.g., 2.5D/3D integration, hybrid bonding, backside power...3DMinimum wageWork experience placementFlexible hours$128.16k - $159.91k
..., and accelerating customer adoption of advanced semiconductor materials, processes, or solutions... ...of semiconductor devices, materials, packaging, or process integration. Experience with... ...and integration concepts such as 2.5D/3D, chiplets, fan‑out, or system‑level considerations...3DPermanent employmentTemporary workWork experience placementFlexible hours
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