Lead 2.5D/3D Packaging Architect (CoWoS/EMIB)
MediaTek
MediaTek is looking for a talented technical leader in San Jose, CA, focusing on advanced packaging technologies (2.5D/3D). This role will involve collaboration with cross-functional teams to develop innovative packaging solutions for automotive and datacenter applications. The ideal candidate will lead projects, coordinate with partners, and possess expertise in package architecture, supply chain management, and communication skills. Salary range is $180,000 - $250,000, with performance bonuses and comprehensive benefits offered. #J-18808-Ljbffr
Vacancy posted 7 hours ago
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