Field Applications Engineer (FAE) Intern Summer 2027

NXP Global Sales Introduction

AI is rapidly moving beyond research labs and into the real worldpowering advancements in vehicles factories hospitals homes and connected devices. NXP brings together secure edge intelligence advanced semiconductor solutions and deep system expertise to help customers build whats next. Our Global Sales and Applications organization partners with customers to align technical solutions to application requirements solve integration challenges and accelerate design wins. We are seeking a technically curious engineering student to join our Field Applications team and help enable the integration of NXP semiconductor technologies into real customer systems.

Program Overview

The NXP Americas Global Sales & Applications Summer Internship is a 12 week paid program for rising juniors seniors and graduate students who combine a strong technical foundation with the drive and curiosity to work directly with customers. Interns are embedded in the Field Application Engineering organization paired with an experienced FAE mentor and assigned meaningful technical work from day one.

This internship is a primary pipeline into NXPs Technical Sales & Applications Program (TSAP) our early-career pathway for full-time technical sales and applications roles. Strong performers may receive a return offer upon graduation.

What Youll Do

As a Field Applications Engineering Intern you will work alongside experienced FAEs on customer-facing technical projects with real business impact. You will help translate application requirements into practical NXP-based solutions support evaluations and proof-of-concepts and develop hands-on experience with embedded systems lab validation and design-in activity. Sample responsibilities include:

Customer Application Support

• Work alongside FAEs to understand customer requirements and help select appropriate NXP MCUs MPUs connectivity analog power-management and edge-processing solutions.
• Support technical customer meetings design reviews product evaluations proof-of-concept activities and NXP solution demonstrations.
• Help analyze customer issues reproduce problems document findings and contribute to clear technical action plans and follow-up.

Embedded Development & System Integration

• Bring up evaluation boards and reference designs; configure SDKs and development environments; and integrate example software into application prototypes.
• Develop or modify firmware and application code in C C Python or similar languages under the guidance of experienced engineers.
• Support embedded software debugging and system integration across real-time control sensor interfaces connectivity Linux or RTOS-based applications.

Lab Validation & Design Support

• Perform product evaluation lab validation and basic system-level troubleshooting using oscilloscopes logic analyzers multimeters power supplies current/voltage probes power analyzers and software debug or trace tools.
• Assist with schematic and PCB reviews interface checks power-up sequencing signal observations and hardware/software integration investigations.
• Create concise test plans capture measurements organize results and communicate conclusions to technical and non-technical stakeholders.

Technical Enablement & Communication

• Prepare customer-ready technical presentations demonstrations quick-start guides application notes and training material with guidance from senior engineers.
• Capture customer feedback and collaborate with sales marketing product management product-line and engineering teams to improve tools software documentation and support content.
• Present your summer project findings technical approach results and recommendations to sales and applications leadership in a final intern capstone presentation.

About You

Minimum Qualifications

• Currently pursuing a Bachelors or Masters degree in Electrical Engineering Computer Engineering Computer Science Mechatronics or a related technical field.
• Rising junior senior or graduate student expected graduation between December 2027 and June 2029.
• Cumulative GPA of 3.0/4.0 or higher.
• Authorization to work in the United States (no sponsorship available for intern roles).
• Availability for 12 weeks full-time during Summer 2027 (MayAugust).

Preferred Qualifications

• Coursework or project experience in embedded systems analog and digital circuits computer architecture microcontrollers/processors wireless communications power electronics control systems or semiconductor applications.
• Hands-on experience with microcontrollers MPUs FPGAs development boards evaluation kits or reference designs; familiarity with ARM-based systems is a plus.
• Programming experience in C C Python or similar languages with exposure to IDEs SDKs version control RTOS basics or embedded Linux.
• Familiarity with common embedded interfaces such as UART SPI I2C CAN USB or Ethernet.
• Experience using or willingness to learn common lab equipment schematic/PCB review board bring-up firmware debugging sensor integration motor control edge AI or robotics applications.

Who Thrives Here

• You are curious about how semiconductor products solve real-world system problems and enjoy learning by building and testing.
• You approach debugging methodically: form a hypothesis measure the system isolate variables and document the result.
• You communicate clearly with engineers customers sales teams and non-technical stakeholders.
• You are proactive take ownership collaborate well and adapt to changing priorities in a customer-focused environment.
• You are motivated to develop both technical expertise and business understanding while contributing to team results.

What Youll Get

• Competitive paid hourly compensation.
• Dedicated FAE/TSE mentor and day-to-day manager support throughout the program.
• Hands-on exposure to the semiconductor applications cyclefrom requirements discovery and technical evaluation through proof-of-concept and design-in support.
• Participation in intern cohort events including professional development workshops executive speaker sessions and cross-functional networking opportunities.
• Access to structured learning on NXP product portfolios embedded systems customer applications and the semiconductor industry.
• Potential relocation support or housing stipend (location-dependent).
• Consideration for a return full-time offer into NXPs TSAP program upon graduation.

Locations

Field Sales Offices across the United States including but not limited to: Austin TX Detroit MI San Jose CA

Preferred location will be discussed during the interview process. Some local customer travel may be expected.

How to Apply

Submit your application through NXPs careers portal at are reviewed on a rolling basis. Early application is strongly encouraged positions fill quickly.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age color national origin race religion creed gender sex sexual orientation gender identity and/or expression marital status status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal state or local addition NXP will provide reasonable accommodations for otherwise qualified disabled individuals.

Required Experience:

Intern