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Thermo-Mechanical Intern (CFD Simulation)

Etched

Requirements Pursuing a degree in Mechanical Engineering or related field Academic or project experience with FEA/CFD tools and analysis Proficiency in SOLIDWORKS/NX, ANSYS Mechanical APDL and ANSYS FLUENT Understanding of semiconductor packaging materials and processes Strong grasp on non-linear properties of materials (elastic-plastic, viscoelastic) Familiarity with CoWoS-S/L/R, TSVs, or 2.5D/3D integration concepts Basic programming/scripting skills (APDL, Python, MATLAB)

  • Desirable) Knowledge of solder joint reliability and failure analysis
  • Desirable) Familiarity with JEDEC standards and reliability testing
  • Desirable) Previous internship in semiconductor industry
We encourage you to apply even if you do not believe you meet every qualification What the job involves We are seeking a talented Thermo-Mechanical, CFD Simulation Engineering Intern focused on Chip-on-Wafer-on-Substrate (CoWoS) package development to join our Advanced IC Packaging Team in Fall '26, Spring '27, or Summer '27 You’ll use tools like ANSYS Mechanical APDL and ANSYS FLUENT to perform critical thermo-mechanical/CFD analysis and contribute to next‑generation high‑performance computing systems Develop FEA models for CoWoS-based IC packages using ANSYS Mechanical APDL Perform thermo‑mechanical stress/strain analysis and thermal cycling simulations Analyze package warpage, solder joint reliability, and interconnect stress Develop CFD models using ANSYS FLUENT for solder reflow modeling Collaborate with design engineering teams on package development #J-18808-Ljbffr Etched

Vacancy posted 17 hours ago
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