Thermo-Mechanical CFD Intern for CoWoS IC Packaging
Etched
Etched is looking for a skilled Thermo-Mechanical, CFD Simulation Engineering Intern to support Chip-on-Wafer-on-Substrate (CoWoS) package development in the Advanced IC Packaging Team. You will engage in critical analysis using ANSYS Mechanical APDL and ANSYS FLUENT for designing next-generation high-performance computing systems. The ideal candidate is pursuing a Mechanical Engineering degree, has experience in FEA/CFD analysis, and proficiency in relevant software tools. This internship offers an opportunity to work on advanced semiconductor packaging processes. #J-18808-Ljbffr Etched
Vacancy posted 1 day ago
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