Staff Engineer - SI/PI for HBM & 2.5D/3D Systems
Micron Technology
Micron Technology, Inc in Richardson, Texas, is seeking a SI/PI Engineer in HBM Design Architecture to execute high-quality SI/PI analysis for interposers and packages. The role focuses on ensuring outstanding signal quality, power delivery integrity, and interface reliability across multiple HBM product generations. The ideal candidate should have at least 5 years of relevant experience and a deep understanding of SI/PI analysis and circuit simulation tools. Micron offers competitive compensation and robust benefits packages. #J-18808-Ljbffr
$146k - $297k
## HBM SIPI, Staff EngineerRichardson, Texas, United States of AmericaApply... ....We are looking for a **SI/PI Engineer in HBM Design Architecture*... ..., PDN architecture, and system PI analysis. You will ensure... ...integrity channel analysis for 2.5D and 3D silicon interposer —...3DFull timeLocal areaImmediate start- 1000 Micron Technology, Inc. is seeking a Senior SI/PI Technical Authority in Richardson, Texas. The role involves shaping system-level decisions impacting performance and reliability across product generations. You will lead signal integrity analysis, define power delivery...3DFlexible hours
- ...Req ID: JR96097 – Senior/Staff Design Verification Engineer, HBM Verification Architecture (Evergreen) Join us... ...SoC verification methodologies, and 2.5D & 3D package integration.... ...Support co‑verification of the overall system and participate in customer interactions...3DLocal areaRelocation
- ...Req ID: JR102225 Staff SoC Physical Verification Engineer, HBM Our vision is to transform how the world uses information... ...verification for advanced‑node system‑on‑chip, memory, or heterogeneous... ...including multi‑die, chiplet, or 2.5D/3D integration. Background in GPU,...3DLocal area
$175k - $309k
...As a senior SI/PI technical authority in the Heterogeneous Integration Group, you will shape system‑level decisions that directly impact performance... ...channel analysis for 2.5D and 3D silicon interposers, including... ...and sign‑off criteria for HBM system designs Provide...3DLocal area- ...developing High Bandwidth Memory (HBM) solutions for AI and ML... ...in the industry. Join us as a Staff Verification Architect and... ...collaborate closely with Design Engineering, Product Engineering,... ...verification methodologies, and 2.5D & 3D package integration to analyze...3DLocal area
- ...implementation of High Bandwidth Memory (HBM) products that power... ...(HPC), and data center systems. You’ll shape physical architecture... ...reliability compliance. Lead engineering change order strategies, improve... ...packaging approaches such as 2.5D interposers and chiplet‑based...Local area
- ...Technology seeks a highly skilled HBM Design Architect to lead the... ..., high‑speed signaling, and 2.5D/3D packaging innovations,... ...AI, HPC, and data‑intensive systems. Key Responsibilities Lead architecture... ..., verification, and system engineering teams. Mentor engineers in...3D
- Micron Technology seeks a Staff DFT Design Engineer in Richardson, Texas to develop and integrate test architectures for next-generation High Bandwidth Memory (HBM) products. This key role involves collaborating with various engineering teams to ensure test coverage across...3D
- ...product and technology leadership, systems-level expertise and global... ...planet. We are looking for a Staff MMIC designer responsiblefor... ...management, mechanical engineering, product engineering, package... ...linear and nonlinear models and 2.5D and 3D electromagnetic simulators. Integrate...3DPermanent employmentWork at office
$125.4k - $163k
...product and technology leadership, systems-level expertise and global manufacturing... ...Qorvo is looking for an experienced Staff RF/Electrical Engineer to join the Defense & Aerospace High... ...cascaded MMIC modules using 2.5D and 3D electromagnetic simulators Design...3DPermanent employmentWork at office- ...architectures while mentoring engineers and improving design... ...critical High Bandwidth Memory (HBM) design blocks and subsystems... ...DRAM, HBM, advanced memory, system‑on‑chip, or application‑specific... ...delivery optimization. Exposure to 2.5D or 3D packaging technologies,...3DLocal area
- ...product and technology leadership, systems-level expertise and global... .... We are looking for a Staff MMIC designer responsiblefor... ...program management, mechanical engineering, product engineering, package... ...linear and nonlinear models and 2.5D and 3D electromagnetic simulators....3DPermanent employmentWork at office
- ...and advance faster than ever. As an HBM SOC Design Engineer, you will be responsible for the... ...performance computing architectures, and 2.5D & 3D package integration to understand and... ...the ability to write and test code in System Verilog. ~ Experience dealing with clock...3DLocal areaImmediate startWorldwide
- ...Staff Design Engineer, HBM Architecture We are seeking a highly motivated HBM Datapath Architect to architect... ...years of relevant industry experience 2+ years of experience in high‑speed... ...and power optimization Job Profile(s) Systems Design Engineer 4 Relocation Level TBD...Local areaRelocation
- ...Req ID: JR102415 Staff SoC DFT Engineer, HBM Job Profile(s): Systems Design Engineer 4 Relocation Level: TBD Responsibilities Own SoC‑level design for test (DFT) architecture and implementation, including scan, memory built‑in self‑test (MBIST), logic built‑in self‑test...Local areaRelocation
- ...is looking for a highly skilled HBM Design Architect. This role... ...generation AI and data-intensive systems. Candidates should have over 10 years of experience in engineering/design, with expertise in nanometer... ...CMOS, DRAM architecture, and 3D integration. Comprehensive...3D
- ...Req ID: JR101099 Staff Memory Design Engineer, HBM. Our vision is to transform how the world uses information to enrich life for all. Micron Technology... .... We are engaged in developing groundbreaking silicon‑to‑systems solutions – right from technology development and...Local area
- ...simulating, optimizing and floor planning HBM Base die and Core DRAM die circuits. In... ...of multi-functional teams such as Product Engineering, Test, Probe, Process Integration, Assembly... ...of memory behavioral models using System Verilog3) HBM specification, design and verification...Local areaImmediate start
- ## Staff Design Engineer - Sustaining, HBMRichardson, Texas, United States of AmericaApply NowFind out how... ...and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering...Local areaImmediate start
- ...Richardson, Texas, is seeking a skilled engineer to play a pivotal role in designing and analyzing... ...to the development of cutting-edge HBM products and ensuring high performance... ...design skills and experience with Verilog and System Verilog, and will be responsible for...
- Req ID: JR101732 - Staff Design Engineer - Sustaining, HBM Micron Technology is a world leader in innovating memory and storage solutions that accelerate... ...ML, high‑performance computing (HPC), and data‑centric systems, collaborating across global engineering and product...Local area
$153k - $265k
...JR-2602026The DFT architect / lead engineer serves as a technical authority and... ...provide expert-level debugging of ATE/System-level failures.* **Methodology &... ...Advanced Packaging:** Knowledge of 2.5D/3D IC testing, TSV probing, or HBM test strategies.* **Yield Analysis:...3D- ...than ever. Job Summary As a Staff DFT Design Engineer, you will work on design, simulation... ...High Bandwidth Memory (HBM) architectures and circuit... ...wafer, die, stack, and system in package (SiP) test stages... ...products. Knowledge of TSV‑based 3D integration and stacked‑die...3DLocal areaRelocation
$146k - $297k
As an HBM Design Architect, you will define how next‑generation... ...products are tested from wafer to system. This role is critical to... ...Master’s degree in Electrical Engineering, Computer Engineering, or related... ...Knowledge of TSV‑based 3D integration and stacked‑die test...3DLocal area$146k - $297k
HBM Design Architect Micron Technology is a world leader in innovating... ..., you will be an HBM Design Engineer contributing to the design and... ...DRAM architectures such as 3D DRAM Background in high‑speed... ...verification teams Job Profile(s): Systems Design Engineer 4 - Systems...3DLocal areaRelocation- ...Micron Technology, Inc in Richardson, Texas is seeking a Staff Design Verification Engineer to enhance High Bandwidth Memory (HBM) solutions. This role involves developing verification plans and methodologies, collaborating with diverse teams, and mentoring engineers....3D
- ...and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you... ...groundbreaking DRAM design, TSV-based 3D integration, and high-speed mixed-... ...validation strategies for highly complex HBM systems. Qualifications BSEE with 7+...3DLocal areaImmediate start
$146k - $297k
1000 Micron Technology, Inc. is seeking an HBM Design Architect to define testing strategies for next-generation HBM products. You... ...candidate should have a Bachelor's or Master's degree in Electrical Engineering and relevant experience, particularly in DFT techniques for...3D- 1000 Micron Technology, Inc. is seeking a Staff Verification Architect in Richardson, Texas... ...verification solutions for next-generation HBM DRAM products. The ideal candidate will have over 7 years of verification engineering experience, particularly in Verilog and mixed...3D
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