Packaging Engineer

Collaborating with design teams, the full-time Senior Package Layout Engineer will focus on the design and development of intricate IC substrate layouts for NVIDIA products, working in a hybrid environment to address manufacturing and electrical design challenges. Key responsibilities Implement high-speed/density ASIC package layouts as part of a collaborative Layout team Optimize package pinout and perform substrate breakout patterns for ASIC packages Conduct design feasibility studies to evaluate package design goals regarding size, cost, and system performance Required qualifications B.S. in Electrical Engineering or equivalent experience 5+ years of experience in PCB layout for graphics cards, motherboards, or related technology Proven experience in substrate layout of wire bond and flip chip packages Significant background with Cadence APD or SiP and/or PCB layout tools Solid understanding of high-speed design signal integrity practices