Senior Packaging Engineer

Driving technology across multiple functions, the full-time Senior Packaging Technical Engineer will define and implement chip pad rings, collaborate with cross-functional teams, and design robust electrical packages, with opportunities for remote work. Key responsibilities Define and implement chip pad rings and substrate interconnect schemes while leading the package layout design process Collaborate with large teams of engineers and managers across various disciplines including Circuit, Signal Integrity, and system design Develop chip floor plans, pad rings, substrates, and ball outs to create a world-class electrical package Required qualifications BSEE or equivalent experience Minimum of 8+ years in board/system design, with package design experience preferred Strong understanding of transmission line theory, power delivery, and signal integrity Programming and scripting skills in Perl, Python, Tcl, and familiarity with Cadence Skill and Excel are preferred Ability to work independently while solving complex technical problems