Senior Multiphysics IC Packaging Engineer
University of Texas at Austin
A prestigious educational institution in Austin, Texas is seeking an experienced professional for a role in semiconductor packaging involving multiphysics simulations and interconnect modeling. The ideal candidate will have an advanced degree and extensive experience with EDA tools. This role involves collaboration with engineering teams and vendors to develop and refine simulation workflows. The position offers competitive benefits, paid time off, and opportunities for professional growth and training. #J-18808-Ljbffr University of Texas
Vacancy posted 5 days ago
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