Staff Engineer - Advanced Packaging Multiphysics Physics Modeling

Requisition ID: 9Role Title: Staff Engineer - Advanced Packaging Multiphysics Physics Modeling (Mechanical- Electrical Co-Simulation)Job Title: Staff Engineer - Advanced Packaging Multiphysics Physics ModelingLocation: Covington, GAJob Type: Full-TimeJob Description:This role owns the simulation, modeling and interpretation of Multiphysics behavior across advanced packaging architectures from die level interconnects through buildup layers to system-level integration. The engineer will build and validate predictive models for mechanical (stress, warpage, fatigue, delamination, cracking, SeWaRe) and electrical (signal/power integrity, thermal-electrical coupling) performance, translating simulation output into design rules and go/no-go decisions for process and product teams. Core work spans finite element analysis (FEA) of interlayer/interface stresses, material characterization and constitutive modeling, failure mode prediction (crack initiation, delamination, via cracking, SeWaRe type reliability failures), and RDL/buildup layer mechanical-electrical co-optimization, closing the loop between simulation predictions and physical failure analysis/reliability test data.Required Skills:FEA modeling (ANSYS, Abaqus, or COMSOL) for stress/strain, thermos-mechanical and fracture mechanics analysis in multilayer stacksInterface/interlayer stress and delamination modeling (cohesive zone modeling, VCCT, traction-separation laws)Material property characterization, and modeling for polymers (dielectrics, mold compounds) metals, (Cu, Ti seed), and glass/ceramic substrates – CTE mismatch, viscoelasticity, plasticityWorking knowledge of RDL buildup layer, and interposer architectures (organic, glass core) and their process induced stress statesFailure mode analysis tied to package reliability (thermal cycling, SeWaRe, drop/shock, warpage) with ability to correlate simulation to physical failure analysis (SEM, CSAM, cross-section)Electrical performance simulation basics – signal/power integrity or coupled electro-thermal-mechanical modelingStrong grasp of semiconductor packaging unit processes (lithography, plating, etch) and how they introduce residual stressScripting/automation for parametric studies (Python, MATLAB, or APDL/Abaqus scripting)Ability to translate simulation results into actionable design rules for process/product engineering teamsPreferred SkillsExperience with panel level packaging reliability predictionExposure to system-level (board + package + die) co-simulationDOE/Statistical methods for correlating simulation with experimental reliability dataFamiliarity with glass core interposer or 2.5D/3D heterogenous integration mechanicsExperience with machine learning assisted surrogate modeling for faster design space explorationEducation: PhD or equivalent industry experience in mechanical engineering materials science, or semiconductor device physicsBenefits:401K 6% matching (NO vesting period)Healthcare 100% support (Health, Dental, Vision)Life, STD, LTD 100 % supportCell phone allowancePTO and self-developmentSALARY:$90,000 – $150,000