Senior SiPh Packaging & 3D Optics Architect
GLOBALFOUNDRIES
GlobalFoundries is seeking an DMTS-grade expert to lead Photonix packaging development, focusing on 2.5D/3D interconnects. You will shape product definition for photonic and electronic packages and collaborate with OSAT partners to enable high‑speed data center solutions. The role demands 20+ years in photonics packaging, with a strong track record in reliability, test methodologies, and cross‑functional leadership across GF and industry ecosystems. #J-18808-Ljbffr GLOBALFOUNDRIES
Vacancy posted 4 days ago
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