SR. NPI Packaging Engineer

Guerrilla RF is a public company that provides high-performance monolithic microwave integrated circuits (MMICs) for the wireless infrastructure market.

WHY CUSTOMERS CHOOSE US. We are partnered with the world’s best semiconductor foundries and assembly houses. We have the supply chain capacity to meet any customer need. Our parts are ready to drop in a customer’s application and take it to the next level. With an installed base of 100M+ units, Guerrilla RF ICs deliver proven, ultra-reliable, game-changing performance for an ever-growing variety of mission-critical applications.

OUR MISSION. Since our inception in 2013, we have dedicated ourselves to the development of innovative, high performance MMICs that allow wireless infrastructure equipment manufacturers to provide greater coverage area and higher data rates.

We find and develop products for numerous under-served market segments that the larger companies are not interested in addressing. Some examples of these market segments are small cells, carrier-class Wi-Fi, and wireless backhaul.

WHAT WE DO. We provide high performance MMICs for the wireless infrastructure market. Our cores form the backbone of today’s state-of-the-art RF and microwave communication systems. Each RFIC is tailored to meet the demanding requirements of wireless infrastructure-grade applications found in 5G, Automotive Connectivity, Cellular Boosters & DAS, Military Radios and Wireless Audio.

Our passion for creating the very best RFICs has led directly to our success as one of the fastest growing semiconductor firms in the industry.

Summary:

Our catalog model depends on moving many new designs quickly and reliably from tape-out to first samples. The Sr. NPI Packaging Engineer owns that handoff. You are the technical bridge between our RF IC designers and our OSAT partners. You turn design intent into buildable package assemblies, drive prototype builds to schedule, and make sure what comes back from the assembly house performs as expected.

Roles & Responsibilities:

Design Team Interface

· Engage with RF IC designers early in each program to select package type, pad/bump layout, and bond strategy that meet RF, thermal, and cost targets.

· Own bonding diagrams, package outline selection, and assembly drawings for each new prototype.

· Advise designers on package parasitics (bond wire inductance, lead frame and substrate effects, ground paths)

· Translate lessons from each build back into design rules and packaging guidelines for the design team.

OSAT Interface

· Serve as the primary technical contact with OSAT partners for all assemblies.

· Prepare and release complete build packages: bonding diagrams, BOMs, wafer maps, marking, tape-and-reel requirements, and special instructions.

· Review and approve OSAT engineering deliverables, including substrate and lead frame drawings, wire bond simulations, and first-article reports.

· Lead technical calls to resolve assembly issues and drive yield improvement.

Prototype Build Management

· Plan and track prototype builds from wafer ship to sample delivery, holding OSATs and internal teams to committed dates.

· Run multiple concurrent prototype programs across QFN, DFN, Air-cavity, WLCSP, flip-chip, and laminate module packages.

Package Development & Continuous Improvement

· Evaluate new package platforms, materials, and processes to extend our catalog, including laminate SiP and multi-die modules.

· Drive 8D corrective actions with OSATs when assembly defects occur.

Transfer to Production & Qualification

· Support package and reliability qualification (MSL, HAST/THB, temperature cycling, HTOL) in partnership with quality engineering.

· Transition validated prototype assemblies to production-ready processes, documentation, and controls at the OSAT.

· Maintain accurate records in document control for every assembly configuration.

Minimum Educational Qualifications:

· BS in Electrical, Mechanical, Materials, or Manufacturing Engineering, or a related field.

Minimum Previous Experience:

· 7+ years of semiconductor packaging or assembly engineering experience

· Experience working with OSATs on new product builds is desired, including build package preparation and first-article disposition.

· Hands-on knowledge of wire bond, die attach, molding, singulation, and tape-and-reel processes.

· Experience with lead frame packages (QFN/DFN) and at least one advanced format (flip-chip, WLCSP, or laminate substrate).

· Working knowledge of how packaging affects RF performance: parasitics, grounding, and thermal paths.

· Proficiency with bonding diagram and package drawing tools

· Familiarity with JEDEC package and reliability standards.

· Strong written and verbal communication; able to explain tradeoffs clearly to designers, OSATs, and management.

Preferred Qualifications:

· Experience at a fabless RF, MMIC, or mixed-signal semiconductor company.

· Packaging experience with GaAs, GaN, SiGe, or SOI RF devices.

· Laminate substrate or SiP module design experience, including substrate layout review.

· Familiarity with AEC-Q100/Q104 automotive qualification requirements.

· Six Sigma, DOE, or statistical process control training.

Key Competencies:

· Bridge builder: earns the trust of both designers and OSAT engineers and gets them to agreement quickly.

· Schedule owner: treats prototype dates as commitments and escalates early when they are at risk.

· Hands-on problem solver: comfortable at the microscope, in the lab, or on the factory floor.

· Speed with discipline moves many designs in parallel without cutting corners on documentation or quality.

· Clear communicator: writes build instructions and reports that leave no room for misinterpretation