Intern - Design Engineer, HIG HBM
Micron Technology Inc
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands‑on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry‑standard design methodologies, EDA tools, and crossfunctional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI‑Assisted and AI‑Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry‑standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI‑Assisted workflows to improve design productivity, debug efficiency, and design‑flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliverables. Document technical work, experimental results, AI‑Enabled insights, and design methodologies to support knowledge sharing and continuous improvement. Minimum Qualifications Currently pursuing a Bachelor's, Master's, or Ph.D. degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field. Completed coursework in Digital Logic Design, CMOS Circuits, Computer Architecture, VLSI Design, Semiconductor Devices, or related subjects. Demonstrated understanding of combinational and sequential logic design concepts. Experience with Verilog, SystemVerilog, or VHDL through academic, research, or project work. Programming experience in Python, Perl, Tcl, C/C++, or similar languages, with strong analytical and problem-solving skills. Preferred Qualifications Knowledge of memory architectures such as DRAM, SRAM, DDR, LPDDR, or HBM. Experience with RTL design, simulation, synthesis, timing analysis, verification methodologies, or functional coverage concepts. Familiarity with Linux/Unix environments, scripting, and automation techniques. Exposure to semiconductor EDA tools such as VCS, Xcelium, Questa, PrimeTime, Innovus, Virtuoso, or similar platforms. Previous academic, research, or internship experience related to VLSI, ASIC, FPGA, semiconductor design, or Applying AI to engineering workflows and analysis. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits. Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron's People Organization at View email address on click.appcast.io or View phone number on click.appcast.io (select option #3). Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payments from candidates as consideration for their employment with Micron. #J-18808-Ljbffr Micron Technology
- ## Intern - Design Engineer, HIG HBMRichardson, Texas, United States of AmericaApply NowFind out how well you match with this jobJob ID: JR112512**Our... ...information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that...InternshipLocal areaImmediate start
- ...enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions... ..., and data‑center applications. Our engineers collaborate across global teams to... ...Internship Overview As an HBM Design Engineer Intern, you will work alongside experienced...InternshipLocal area
- ...Heterogeneous Integration Group (HIG) HBM Architecture team develops... ...(HBM) architectures, PHY design methodologies, and automation... ...closely with Architecture, Design Engineering, Verification, Product... ...Senior or Graduate Engineering Intern, you will collaborate with experienced...InternshipLocal areaImmediate start
- Micron Technology, Inc. invites an Intern Design Engineer to join the HBM design team in Richardson, TX. You will work on designing, simulating, and verifying HBM memory and logic circuits, with exposure to RTL, timing, power analysis, and AI-assisted workflows across...Internship
- Micron Technology, Inc. is seeking an HBM Design Engineer Intern to contribute to the development and verification of next-generation memory solutions. You will work with experienced engineers, gaining hands-on exposure to verification methodologies, simulation environments...Internship
- Micron Technology in Richardson, TX is seeking an HBM Design Engineer Intern to work with memory engineers on design, simulation, verification, and analysis of HBM memory and logic circuits using industry tools. You will gain hands-on experience across RTL, timing, power...Internship
- Micron Technology, Inc. is seeking an HBM Design Engineer Intern to work with memory engineers on design, simulation, and verification of HBM memory and logic circuits. You will contribute to RTL development, timing and power analysis, and functional validation in a collaborative...Internship
- Micron Technology, Inc. in Richardson, Texas is seeking an Intern - Design Engineer for the HBM group. You will design, analyze, and optimize memory circuits for High Bandwidth Memory products, collaborating with global design and product teams to meet performance and...Internship
- Micron Technology, Inc. is seeking an HBM Design Engineer Intern to contribute to the design, development, and validation of advanced HBM memory products. You will work with experienced engineers across RTL, simulation, and AI‑assisted workflows in a collaborative global...Internship
- Micron Technology, Inc. in Richardson, TX, is seeking an Intern - Design Engineer to contribute to advanced HBM memory design. You will assist with design, simulation, analysis, and verification of memory circuits using industry-standard EDA tools and RTL development....Internship
- ...than ever. At Micron Technology, our HBM (High Bandwidth Memory) Engineering team develops advanced memory... ...The team collaborates across global design, verification, and product engineering... ...worldwide. As an HBM Design Engineer Intern, you will work alongside experienced...InternshipLocal areaWorldwide
- ...faster than ever.As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist... ...laws, rules, regulations, and other international and industry labor standards.Micron...Full timeLocal areaImmediate startNight shift
- ...Heterogeneous Integration Group (HIG) within Micron's Technology... ...of High Bandwidth Memory (HBM) solutions for AI and ML applications... ...in the industry.As a Design Engineer at Micron Technology, Inc., you... ..., regulations, and other international and industry labor standards....Full timeLocal areaImmediate start
$121k - $247k
...advance faster than ever.As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design,... ...of next‑generation HBM SoC logic die. You will work... ...used in HBM logic die.Integrate internal and third‑party IP (e.g., controllers...Full timeLocal areaImmediate startNight shift- ...Heterogeneous Integration Group (HIG) is shaping the future... ...! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML,... ...across global engineering and product teams to deliver... ...regulations, and other international and industry labor...Full timeLocal areaImmediate start
- ...Heterogeneous Integration Group (HIG) within Micron's Technology... ...of High Bandwidth Memory (HBM) solutions for AI and ML... ....Micron is seeking a Design Infrastructure Engineer to build, enable, and scale... ...technologies. These encompass Micron internal nodes as well as external...Full timeLocal areaImmediate start
- ...Heterogeneous Integration Group (HIG) is shaping the future... ...! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML,... ...across global engineering and product teams to deliver... ...regulations, and other international and industry labor...Full timeLocal areaImmediate start
- ...communicate and advance faster than ever.Micron’s HIG HBM Digital Design Group is seeking a Digital Design Engineer to contribute to the architecture, RTL... ...applicable laws, rules, regulations, and other international and industry labor standards.Micron does not charge...Full timeLocal areaImmediate start
- ...Heterogeneous Integration Group (HIG) sits within the... ...High Bandwidth Memory (HBM) solutions for AI and... ...and bandwidth. Our designs span custom digital and... ...a Senior Verification Engineer and contribute to modular... ...regulations, and other international and industry labor standards...Local areaImmediate start
- ...Heterogeneous Integration Group (HIG) sits within the... ...High Bandwidth Memory (HBM) solutions for AI and... ...and bandwidth. Our designs span custom digital and... ...Senior Design Verification Engineer, you will collaborate... ...regulations, and other international and industry labor standards...Full timeLocal areaImmediate start
- ...Heterogeneous Integration Group (HIG) sits within the... ...Bandwidth Memory (HBM) solutions for AI and... ...density and bandwidth. Our designs span custom digital... ...closely with Design Engineering, Product Engineering,... ...regulations, and other international and industry labor standards...Full timeLocal areaImmediate start
- Micron Technology, Inc. in Richardson, TX is seeking an Intern - Design Engineer to support verification and validation of High Bandwidth Memory products. You will learn and apply industry-standard verification methodologies, simulate timing, debug issues, and contribute...Internship
- ...Heterogeneous Integration Group (HIG) sits within the... ...Bandwidth Memory (HBM) solutions for AI and... ...density and bandwidth. Our designs span custom digital... ...closely with Design Engineering, Product Engineering,... ...regulations, and other international and industry labor standards...Local areaImmediate start
$150k - $308k
...communicate and advance faster than ever.HBM Core-Die Architecture & Circuit Design EngineerThis role owns next‑... ..., and long‑term reliability. The engineer will drive architecture definition... ...laws, rules, regulations, and other international and industry labor standards....Full timeLocal areaImmediate start- ...than ever.Job DescriptionThe HBM Architecture team develops advanced... ...collaborates closely across design, PHY, ECC, verification,... ...channel HBM architectures and wide internal busesOptimize datapath... ...Bachelor’s degree in Electrical Engineering, Computer Engineering, or a...Full timeLocal areaImmediate start
$150k - $308k
...advance faster than ever.Job DescriptionWe are the HBM Design Architecture team within Micron’s HBM DRAM Engineering Group. We work at the intersection of design,... ...DRAM products. You will serve as a bridge between internal design teams, foundries, and technology...Full timeLocal areaImmediate startWorldwide- ...faster than ever.Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑... ...flow robustnessInterface with EDA vendors and internal CAD teams to debug tool issues, evaluate new...Full timeLocal areaImmediate start
- ...subsystem, full-chip, and system-level HBM and DRAM designs to ensure functional correctness,... ...global design, architecture, product engineering, and system engineering teams to ensure... ...laws, rules, regulations, and other international and industry labor standards.Micron does...Full timeLocal areaImmediate start
$146k - $297k
Job Description The HBM Architecture team develops advanced datapath... ...collaborates closely across design, PHY, ECC, verification,... ...channel HBM architectures and wide internal buses Optimize datapath... ...Bachelor’s degree in Electrical Engineering, Computer Engineering, or a...Full timeLocal areaRelocation- Micron Technology, Inc. in the United States is seeking a Principal HBM Architecture & Circuit Design Engineer to own next‑generation HBM core‑die architecture and critical DRAM circuit design that impact bandwidth, power, area, and reliability across advanced 3D‑stacked...
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