Senior SI/PI Engineer for 2.5D/3D Packaging
HCLTech
HCLTech is seeking a highly talented SI/PI Engineer to join our Advanced Silicon Packaging team. The role focuses on signal integrity and power integrity analysis, modeling, and design optimization for next‑generation multi‑die packaging architectures including 2.5D/3D integration and HBM interfaces. You will collaborate with IC design, substrate, PCB, and thermal teams to co‑optimize package electrical performance, develop and validate high‑speed channel models, and correlate simulations with #J-18808-Ljbffr HCLTech
Vacancy posted 1 day ago
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