Senior 2.5D/3D Packaging Engineer — NPI & HVM Expert
$160k - $190kCelestial AI
Celestial AI is seeking an experienced Semiconductor Packaging expert in Santa Clara, California. In this role, you will manage and drive AI product assembly processes from concept to high volume manufacturing, involving hands-on experience in TSV and wafer processes, along with project management skills. The ideal candidate will have over 15 years of experience in Semiconductor Packaging and a strong background in project management. The company offers a competitive base salary of approximately $160,000 to $190,000 along with excellent benefits. #J-18808-Ljbffr Celestial AI
Vacancy posted 3 days ago
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