Optical Packaging Engineer

Responsibilities Lead next generation optical package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met. Own all the development of all the optical coupling activities and designs: fiber pigtail, lens alignment and coupling, free space optics, gratings, collimators, etc. Optimize the optical coupling efficiency of optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets. Hand‑on process development with the R&D manual aligners and automated aligner within Nokia premises. Survey advanced optical coupling solutions, materials and vendors to stay current with new technological advancements. Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products. Drive package debug activities during product validation and qualification. Support the development activities at our Contract Manufacturers, both remotely and on‑site to ensure a smooth transition to mass production. Qualifications 2-4 years of experience. Experience in high-speed electronics package design and laser package design. Experience with optical coupling, fiber pigtail attachment, free space optics. Experience in microelectronics, optoelectronics packaging design and assembly. Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding. Hand‑on experience with automated alignment tools, fiber optics, epoxy dispensation, optical measurement and metrology. Experience with documentation of fabrication, inspection, and assembly processes. Solid interpersonal, communication and problem‑solving skills in order to interact with engineering staff, external vendors and contractors effectively. Experience with package and process design/development from design to production. Additional qualifications Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools, such as DOE, SPC, and Six‑Sigma process and analysis; Familiar with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc. Expertise in high-volume packaging of 2.5/3D packages. Knowledge of material properties and associated mechanical part fabrication processes. Familiar with flip chip, BGA, PCBA, flex design reliability and processing. Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience. We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect. #J-18808-Ljbffr NOKIA