Associate Optical Packaging Engineer

Job Summary We are seeking a highly motivated Optical Packaging Associate Engineer to help drive hands‑on engineering validations, build, and process development. The Associate Engineer will build fiber‑coupled optical packages with photonic chips and work closely with the optical packaging and operations teams. Responsibilities Support hand‑on manufacturing of fiber‑to‑chip packaged chip assemblies. Support the development, optimization, and validation of optical packaging and active alignment processes for photonic components and fiber attach assemblies. Assist in process characterization activities for optical module packaging, including alignment, adhesive curing, and optical performance evaluation. Execute experiments and collect data to improve optical coupling efficiency, process stability, and assembly yield. Support NPI (New Product Introduction) activities by contributing to process development, documentation, and production readiness. Participate in troubleshooting manufacturing and reliability issues using structured problem‑solving methodologies. Help develop and maintain process documentation including work instructions, process flows, and control plans. Collaborate with cross‑functional teams including design, manufacturing, test, and reliability engineering. Support equipment setup, calibration, qualification, and maintenance activities for optical assembly processes. Work with vendors and internal teams to evaluate materials, tooling, and process improvements. Analyze process and metrology data to identify trends and opportunities for yield and quality improvement. Experience/Qualifications Bachelor's or Master's Degree in Engineering, Physics, Materials Science, or a related technical field. 1‑3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing environments (internships and research experience may be considered). Basic understanding of optical alignment, fiber optics, and optical measurement techniques. Exposure to semiconductor assembly, precision alignment systems, or automated manufacturing equipment. Hands‑on laboratory or manufacturing experience with precision assemblies and metrology tools. Good communication and collaboration skills with cross‑functional engineering teams. Strong problem‑solving skills with the ability to work in a fast‑paced development environment. Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly is a plus. Experience with data analysis tools such as Excel, JMP, MATLAB, or Python is beneficial. Understanding of statistical process control (SPC), DOE, or basic yield analysis concepts is a plus. EEO Statement PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race, color, religion, sex (including pregnancy, childbirth, or related medical conditions), gender identity, gender expression, national origin, ancestry, citizenship, age, physical or mental disability, military or veteran status, marital status, domestic partner status, sexual orientation, genetic information, or any other basis protected by applicable laws. Important Note PsiQuantum will only reach out to you using an official PsiQuantum email address and will never ask for bank account information as part of the interview process. Please report any suspicious activity to View email address on click.appcast.io. Salary and Benefits U.S. Base Pay Range: $85,000 – $120,000 USD. Bay Area Pay Range: $115,000 – $130,000 USD. Base pay is only one part of the total compensation package. Full‑time roles are eligible for equity and benefits. #J-18808-Ljbffr PSI Quantum