Lead Silicon Photonics Packaging Engineer
NOKIA
NOKIA is seeking a Packaging Development Engineer in Sunnyvale, California, to lead the design of next-generation packaging solutions for optical technologies. In this role, you will innovate and collaborate with cross-functional teams on key processes like flip chip and reflow. Your expertise in high-speed electronics packaging and problem-solving will drive the development to ensure seamless mass production of advanced optical packages. If you have strong communication skills and a passion for technology, we encourage you to apply! #J-18808-Ljbffr NOKIA
Vacancy posted 1 day ago
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