Packaging Engineer
Micron Technology
Micron Technology, Inc. in Idaho is seeking a highly experienced Design Engineer to enable our Advanced Packaging Technology Development team. You will drive electrical, thermal, and thermo‑mechanical design and characterization of next‑generation semiconductor packages, including HBM, W2W, COW, Flip Chip, and TSV, with AI/ML integrations to improve simulations and data‑driven decisions. The role collaborates with global R&D, suppliers, and manufacturing, supervising testing, multistage #J-18808-Ljbffr
Vacancy posted 2 days ago
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