Manufacturing Technician (DL) - Wirebonding

Job Overview We are looking for a Manufacturing Technician to process wafers, dies, and packaged components in a cleanroom environment at Microchip Technology Inc. Responsibilities Follow detailed written instructions and perform a variety of assembly and inspection operations. Use microscopes extensively to inspect and manipulate small components. Operate small hand tools for assembly, adjustment, and repair tasks. Read and interpret technical drawings and process travelers to determine correct placement of components. Perform die attach operations, ensuring precise alignment and secure attachment of dies to substrates or packages. Assemble components according to process specifications and quality standards. Handle wafers and individual dies with care to prevent contamination or physical damage; follow cleanroom protocols. Set up, operate, and troubleshoot wire bonding equipment; perform wire bonding operations to connect dies to package leads or substrates; conduct pull tests to verify bond strength and integrity; document and report test results. Inspect assembled products and components at various stages of production using visual inspection, microscopes, and other tools to ensure compliance with Microchip quality standards; identify and report defects or process deviations. Operate production machinery such as plasma cleaners, ovens, and other specialized equipment; monitor equipment performance and report issues or malfunctions. Enter process data, inspection results, and signoffs into computer systems and process travelers; maintain accurate and timely records for traceability and quality assurance. Interface with team members, supervisors, engineers, and other departments to coordinate production activities; communicate clearly in English, both verbally and in writing. Demonstrate commitment to Microchip’s Guiding Values, including teamwork, integrity, and continuous improvement; participate in company initiatives and support a positive work environment. Perform additional tasks as assigned by supervisors or management. Qualifications High School Diploma or GED. Experience using a microscope for inspection or assembly tasks. Minimum 2 years of wire bonding experience with expertise in equipment setup, process optimization, and troubleshooting. Basic knowledge of Microsoft Windows, Adobe Acrobat Reader, Internet Explorer, and Outlook. Ability to work independently with minimal supervision. Good hand‑eye coordination and manual dexterity for handling delicate wafers and dies. Strong verbal and written communication skills in English. Effective interpersonal skills for building positive relationships across departments. Preferred Qualifications Knowledge of Lean manufacturing principles, including 5S workplace organization. Previous experience in a manufacturing or cleanroom environment. Additional Information Opportunities for advancement to higher technician grades or specialized roles based on performance and experience. U.S. Export Controls Requirements: Candidates must provide proof of US citizenship, Permanent US residency, or classification as a protected individual as defined in 8 USC 1324b (a)(3). Travel Time: No Travel. Physical Requirements: 100% Inside, 60% Standing, 40% Walking, 10% Sitting, Carry 25 lbs. This position may involve carrying, climbing, crouching, feeling, foot controls, handling, hearing, kneeling, lifting, noise and/or vibration, pulling, pushing, reaching, seeing, stooping, talking, working alone, and working around others. Equal Employment Opportunity Statement Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected veteran status, age, or any other characteristic protected by law. #J-18808-Ljbffr FHLB Des Moines