Senior SI/PI Engineer — 2.5D/3D Advanced Packaging
Excelon Solutions
Excelon Solutions, Sunnyvale, CA, seeks an experienced SI/PI Engineer to advance signal and power integrity analysis for next-generation packaging, including 2.5D/3D architectures and high-bandwidth memory interfaces. You will develop high-speed channel models, perform full-wave EM simulations, and optimize PDN from die to board, collaborating across IC, substrate, PCB, and thermal teams. Strong Python/MATLAB/Tcl scripting and lab measurement experience are required. #J-18808-Ljbffr Excelon Solutions
Vacancy posted 1 day ago
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