Chip Package SI/PI Engineer — 2.5D/3D Interconnects
Socket.dev
Google is seeking a Chip Package SI/PI Engineer in Sunnyvale to shape AI/ML hardware acceleration through advanced package technology and silicon interposer concepts. You will drive co-design across chip, package, and system, guiding SI/PI analysis for production-ready implementations and robust, high-speed interfaces. The role emphasizes cross-functional collaboration with ASIC, board, and system teams, plus hands-on modeling with industry tools. #J-18808-Ljbffr Socket.dev
Vacancy posted 5 days ago
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