Packaging Specialist

Advanced Packaging Technical LeaderCisco is seeking a seasoned Advanced Packaging Technical Leader to join the Packaging Technology & Quality team within our world-class Supply Chain Organization. As a Technical Leader you will drive innovation in advanced packaging technology and quality for Cisco's cutting-edge Optics products.Your ImpactYou will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and multi-functional environment. This includes close partnerships with design engineering, operations, and supply chain teams to innovate next-generation technologies. You will also engage directly with counterparts at OSATs, Fabs, contract manufacturers and other key suppliers leading technical discussions and problem-solving efforts as well as influencing commodity strategy at a global scale.This role offers significant technical scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms. Key responsibilities:Serve as a technical leader in advanced packaging technology (flip-chip, fanout, 2.5D/3D, hybrid integration). Oversee various aspects such as package assembly, process development, reliability qualification, materials and testing.Work with top-tier package assembly partners to develop and qualify packaging solutions for Cisco products.Multi-functional technical leadership to proactively identify and mitigate risks, and resolve highly complex packaging issues. Drive/support quality initiatives such as failure analysis (FA), root cause finding, and implementation of corrective actions.Work collaboratively with design teams to influence package architecture and provide expert guidance on Design for Manufacturability/Reliability (DfM, DfR) contributing to the definition of critical parameters for HVM.Contribute to evaluation of new packaging methods, materials and processes for Cisco product design and implementation.Minimum Qualifications:MS or PhD in Mechanical Engineering, Materials Science/Engineering, Electrical Engineering, Physics or similar field.7+ years of progressive industry experience in Advanced Packaging with demonstrable track record of technical leadership and successful project execution.Demonstrated experience in advanced packaging assembly processes (e.g fine pitch bumping, flip chip, molding, 2.5D, hybrid integration)Deep expertise in Design for Manufacturing & Design for Reliability methodologies, specifically how packaging choices affect performance and yieldPreferred Qualifications:Familiarity with industry standard reliability testingWorking knowledge of simulation and modeling softwareExperience with basic failure analysis and root cause identification for packaging related issues.