Ocotillo Technology Fabrication Dry Etch Module Equipment Technician (Entry-level)

Job Details: Job Description: Join Intel and build a better tomorrow. Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. As a Dry Etch Module Equipment Technician, you will play a critical role in Intel's high-tech manufacturing process, ensuring our tools are optimized for world-class production. Your contributions will directly impact Intel's innovation, enabling the delivery of advanced technologies that power the future of computing. This is an exciting opportunity to grow your technical expertise, work alongside engineering teams, and be part of a collaborative environment where your skills make a tangible difference. This role is intended for module equipment technicians to report to the Dry Etch department. This role has opportunities across all shifts (4/5/6/7) as needed per functional area. The Dry Etch Module Equipment Technician will be responsible for but not limited to: Perform functions associated with all wafer production including operations, equipment, process and training. Equipment maintenance and repair, equipment troubleshooting, defect reduction, and other duties as required supporting Fab objectives. Work from technical manuals, specifications, drawings/diagrams, schematics, written and verbal instructions utilizing a variety of tools, test equipment, problem solving techniques and communication. This position is for a Compressed Work Week Schedule with availability on all shifts (4/5/6/7) in Ocotillo Technology Fabrication (Fab52/42/32/12). Ideal candidate behavioral traits Self-motivated Verbal and written communication skills and to be comfortable presenting issues and solutions. Skills to work well in a diverse team environment and multitask. Skills to work with minimal supervision and adjust to rapidly changing priorities. Skills to produce results in a timely manner. Analytical problem solving and testing skills. Work Schedule and Physical Requirements Candidates must be willing and able to: Work a compressed work week consisting of three consecutive 12 hour shifts, followed by a four-day work week of 12 hour shifts every other week. Shift 4 - Night front half of week - PM-AM Sun-Tues and alternating Saturday nights Shift 5 - Days front half of week - AM-PM Sun-Tues and alternating Wednesday days Shift 6 - Night back half of week - PM-AM Wed-Sat and alternating Saturday night Shift 7 - Days back half of week - AM-PM Thurs-Sat and alternating Wednesday days Perform work in a cleanroom environment while wearing required PPE, including coveralls, hood, booties, safety glasses, and gloves. Willing to wear a respirator Lift up to 35 pounds (18 kgs) at least 4 times a day. Spend the majority of the shift (over 90 percent, excluding breaks) in a cleanroom environment. Walk approximately 2-4 miles per shift and stand or sit for extended periods (up to 9 hours). Climb ladders as required by the role. Work in proximity to chemicals while following all safety procedures. Qualifications High School (HS) Diploma/GED or higher non-semi degree AND 6+ months of Dry Etch 300mm semiconductor equipment maintenance experience HS/GED or higher non-semi degree AND 1+ year Technical certification or trade school HS/GED or higher non-semi degree AND 2+ years hand on technical experience including military technical experience Associate degree STEM Related to semi. Mfg. Preferred Qualifications Military experience Advanced Node Semiconductor manufacturing experience in a production environment. Experience in etch functional area. Experience performing hands‑on preventative, corrective maintenance on 300mm semiconductor equipment (or equivalent experience). Demonstrated skills to influence the content and creation of new specs, procedures and business processes related to equipment maintenance. Bachelor's degree in a STEM field. Knowledge of process control systems. Experience with schematics and complex drawings/diagrams. Integrated circuit fabrication experience. Job Type: Tech Grad Shift: Shift 5 (United States of America) Primary Location: US, Arizona, Phoenix Additional Locations: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $44,230.00-73,010.00 USD (Hourly Role) Work Model for this Role This role will require an on-site presence. Job posting details such as work model, location or time type are subject to change. Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. #J-18808-Ljbffr Intel Corporation