Signal Integrity Engineer: 2.5D/3D Interconnects & Sign-Off
$143.8k - $230kJobleads-US
Broadcom Inc. in San Jose, CA seeks an experienced SI/PI engineer to drive sign-off for next‑gen ASIC interconnects, including 2.5D/3D packaging. You will perform timing sign‑offs, EM extraction, and PDN/PDN analysis, collaborating with R&D, IP, customers, and manufacturing partners.
The role blends AE and R&D duties, requires TCL/Python scripting, and experience with DDR/LPDDR or HBM SI/PI sign-off flows. Base salary ranges from USD 143,800 to 230,000 plus equity and benefits.
#J-18808-Ljbffr Jobleads-US$143.8k - $230k
...industry encompassing 3D and 2.5D interconnects. We are seeking an experienced SI/PI engineer to develop our next... ...extraction and modeling of signal and power delivery... ...networks.* Automate sign-off processes and work... ...roles.* Flexibility to integrate new ideas and tools to...3DLocal areaWorldwide$213k - $287.5k
...Sr. Signal & Power Integrity Engineer, Annapurna Labs - AI Silicon Packaging Annapurna... ...early architecture trade-offs through design closure,... ...-level SI/PI analysis for 2.5D, 3D-IC, fan-out, and silicon interposer... .... Model advanced interconnects: microbumps, C4 bumps,...3DLocal areaFlexible hours- ...replace traditional copper interconnects with advanced fiber-... ...for CspeedIO optical engine packages across both thermal... ...are used for design sign-off, so assumptions must be... ...: flip chip, 2.5D/3D, interposers, and heterogeneous integration. Preferred Qualifications...3D
$185.2k - $250k
...Design Automation Engineer to join our... ...features to design 2.5D interposer, 3D-IC, fan-out wafer... ...for high-density interconnects including microbumps... ...Develop data integration flows for co-design... ...package will include sign-on payments and... ...matching, paid time off, and parental...3DFlexible hours- ...Signal/Power Integrity Hardware Engineer San Jose About the Company: At SK Hynix Memory Solution, we're at the forefront of semiconductor innovation... .../5, LPDDR4/4x, NVIO and PDN. ~ Strong fundamentals in 3D/2D EM simulation tools and transmission line theory. ~...3DWork experience placementFlexible hours
- ...experienced Senior Principal Signal Integrity Engineer to join its engineering... ...requirements. Analyse high-speed interconnect performance, including... ...evaluate performance trade-offs and identify opportunities... ...tools such as Ansys HFSS, Q3D or PowerSI. ~ Extensive...3DPermanent employmentFull time
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## Manager Systems Engineering 2 - Targeting Integration & TestUnited States-Illinois-Rolling MeadowsFlexible LocationRELOCATION ASSISTANCE: Relocation... ...insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.The...Full timeFor contractorsRelocation packageFlexible hoursShift work$157.6k - $185k
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...Hardware Development Engineer, Hardware... ...massive scale and rapid integration of emergent technologies... ...or equivalent ~2 years experience in... ...~ Proficiency with 3D CAD tools (e.g.,... ...package will include sign-on payments and restricted... ..., paid time off, and parental leave...3DOverseasFlexible hours$125k - $200k
...Department:** Hardware Engineering**Location:** Somerville... ...saving medical devices. Our 3D printing technology... ...from scratch when off the shelf options have... ...electronics* Experience with signal processing and/or... ...Experience debugging signal integrity and EMC issues**Our Perks...3DWork at officeWorldwideFlexible hours- ...fast experiments, careful signal acquisition, embedded electronics, mechanical integration, and taking successful... ...and test rigs using CAD, 3D printing, basic machining, and off-the-shelf components.... ...mechatronics, or robotics engineering. Experience taking electromechanical...3DContract work
- ...Cspeed IO in Palo Alto seeks an experienced FEA engineer to drive thermal and structural analysis for optical engine packages. You... ...in one major FEA/CFD tool plus a second for the complementary domain; experience with 2.5D/3D integration and #J-18808-Ljbffr Jobleads-US3D
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