Sr Thermal Simulation Engineer, HBM

Overview Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Heterogeneous Integration Group (HIG) sits within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications. We stack multiple DRAM chips on a high‑speed memory controller using TSV (Through Silicon Via) technology, dramatically increasing memory density and bandwidth. Our designs span custom digital and RTL2GDS flows, and we are targeting the lowest power per bit in the industry. Responsibilities Develop high‑fidelity thermal and thermo‑mechanical models for HBM packages, including die, interconnects, bonding interfaces, and system‑level integration. Perform multiphysics simulations (thermal, structural, and coupled analyses) to evaluate performance, identify risks, and guide design decisions. Analyze and explain thermal transport, heat flux distribution, and thermo‑mechanical behavior across complex stacked memory architectures. Drive simulation‑to‑silicon correlation by working with characterization and test teams to validate models and refine assumptions. Evaluate material properties, layout effects, and package architecture on thermal resistance and hotspot behavior. Collaborate cross‑functionally with design, packaging, process, and test teams to enable thermally‑aware product development. Provide actionable insights, design recommendations, and risk assessments based on simulation results. Contribute to development of modeling methodologies and scalable simulation frameworks for HBM and advanced packaging technologies. Qualifications MS + 3 years experience or PhD in Mechanical Engineering, Materials Science, Physics, or a related field. Experience in thermal simulation or multiphysics modeling within semiconductor or advanced packaging domains. Strong foundation in heat transfer, thermodynamics, and solid mechanics. Hands‑on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star‑CCM+, FloTHERM or equivalent). Demonstrated ability to model and interpret thermo‑mechanical phenomena such as thermal resistance, heat spreading, stress, and material interaction effects. Experience with finite element modeling (FEM) and coupled simulations involving thermal and structural domains. Preferred Skills Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers. Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems. Knowledge of simulation‑to‑silicon calibration workflows and experimental validation techniques. Exposure to CFD or flow‑based simulation for cooling or package‑level heat transfer. Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results. Benefits We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. Equal Opportunity Employer Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws. #J-18808-Ljbffr 1000 Micron Technology, Inc.