Senior Packaging Engineer

Driving technology across multiple functions, the full-time Senior Packaging Technical Engineer will craft and implement silicon pad rings and lead the package layout design process while collaborating with cross-functional teams in a remote environment. Key responsibilities Define and implement chip pad rings, substrate interconnect schemes, and lead package layout design Collaborate with engineers and managers from various disciplines, including Circuit, Signal Integrity, and system design Develop chip floor plans, pad rings, and robust electrical packages Required qualifications BSEE or equivalent experience Minimum of 8+ years in board/system design, with package design experience preferred Strong understanding of transmission line theory, power delivery, and signal integrity Programming and scripting skills in Perl, Python, Tcl, and familiarity with Cadence Skill and Excel are advantageous Ability to work independently and tackle complex technical problems