Principal Process Integration Engineer

Company Description

Join a multibillion-dollar global company that brings together amazing technology, people, and operational scale to become a powerhouse in the memory industry. Headquartered in Rancho Cordova, California, Solidigm combines elements of an established, successful technology company with the spirit, agility, and entrepreneurial mindset of a start-up. In addition to the U.S. headquarters and other facilities in the U.S., the company has international presence in Asia, Europe, and the Americas. Solidigm will continue to lead the world in innovating new Memory technologies with aspirations to be the #1 NAND memory company in the world. At Solidigm, we view problems as opportunities to define innovative solutions that hold the power to change the world and unleash the potential technological needs that the future holds. At Solidigm, we are One Team that fosters a diverse, equitable, and inclusive culture that embraces individual uniqueness and empowers us to bring our best selves to deliver excellence in support of Solidigm's vision and mission to be the go-to partner for optimized data storage solutions. You can be part of the takeoff of an innovative business that develops cutting-edge products, delivers strong business value for customers, provides an engaging workplace for its employees, and serves a greater impact on the world. This is a golden opportunity for the right applicant to join us and help design, build, and lead Solidigm. We want a diverse team of dedicated professionals who will not just be Solidigm team members but contribute to how we shape the future of the organization. We are seeking applicants who will grow and thrive in our culture; be customer inspired, trusting, innovative, team-oriented, inclusive, results driven, collaborative, passionate, and flexible.

Job Description

Solidigm is seeking a Principal Engineer of 3D NAND Process Integration with broad experience in semiconductor technology development. As a Process Technology expert in Technology Development team, you will participate in next generation NAND process technology qualification to meet customer product requirements for performance, reliability, and yield, and transfer the technologies to high-volume manufacturing. Your expertise will primarily focus on process engineering, working with the Device, Product Engineering, Design, and Quality Assurance teams to debug any Si related issues for product qualification and ramp.

Job responsibilities include, but not limited to :

• Define process flow and process target spec to meet customer product requirements
• Lead a multidisciplinary team of process, device, manufacturing, reliability, and design engineers for product PRQ and manufacturing transfer
• Identify and resolve process-related issues through a model-based problem-solving technique
• Use statistical tools to draw conclusions and drive data-driven decisions to improve performance, reliability, and yield
• Drive continuous improvement initiatives to enhance performance, reliability, and yield in cost effective way
• Collaborate with cross-functional teams to develop, optimize, and troubleshoot semiconductor manufacturing processes and transfer new technologies into high-volume production

Qualifications

• MS or PhD degree in Electrical Engineering, or Material Science, or relevant major, with 10+ years of experiences in semiconductor process field.
• Respectful leadership skill to enroll multidisciplinary team members for project management
• Technical breadth and depth in semiconductor processing techniques and device physics
• Strong analytical and problem-solving skills, excellent attention to detail
• Demonstrated ability to work in a collaborative team environment
• Highly skilled in time management and able to work on multiple projects simultaneously
• Self-motivated and ability to work independently on projects
• Willingness to learn and adapt to new technologies and methodologies
• Excellent written and oral communication skills

Working Condition

• This position is primarily for a hybrid work based in California. Frequent travel to China and other sites is required. The office environment is collaborative and fast-paced, requiring the ability to manage multiple tasks effectively.

Additional Information

This position is also eligible to participate in Solidigm's restricted stock unit (RSU), restricted cash unit (RCU), and cash bonus programs. In addition, Solidigm offers a benefits package that includes medical, dental, vision, supplemental life and AD&D insurance; short- and long-term disability; healthcare and dependent care flexible spending accounts, and a company match on eligible 401(k) plan contributions.

The compensation range for this role is $221,360 - $354,200. Actual compensation is influenced by a variety of factors including but not limited to skills, experience, qualifications, and geographic location.

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Department: NAND Development Compensation: USD 221360 - USD 354200 - yearly