Manufacturing Operations Leader

Responsibilities Manage master wafer start plan and daily execution cadence, balance demand, capacity, engineering work, and maintenance windows, achieve committed output, cycle time, and on‑time delivery metrics. Ensure shift staffing alignment with wafer start and production loads, guarantee gown room readiness for all shifts and contingency scenarios, and train and enforce cleanroom discipline and standard work. Ensure seamless lot movement with zero wafer loss or misprocessing, drive AMHS reliability and manual transport discipline, and minimize wafer handling defects and contamination risks. Ensure spares availability to meet tool uptime and production targets, drive cost discipline through optimized inventory management, and maintain accurate and audit‑ready inventory logs and traceability. Lead Lean, Six Sigma, and SPC initiatives focused on cycle time reduction, lot start predictability, and inventory optimization; apply structured root‑cause analysis (8D, FMEA) to recurring FAB issues. Requirements Ten years in semiconductor FAB or advanced packaging manufacturing. Five years leading 24/7 manufacturing or operations teams. Direct experience managing wafer lot starts and WIP control, cleanroom and gown room operations, and FAB material flow and logistics. Strong background in advanced packaging or back‑end semiconductor operations. Deep understanding of FAB manufacturing flows and constraints, wafer lot control, dispatch rules, and MES logic, and advanced packaging integration steps. Working knowledge of AMHS and wafer handling systems, spares, BOMs, and preventive maintenance strategies, inventory control systems, and ERP integration. Expertise in SPC and yield management, OEE, MTBF, MTTR, and cycle time analysis, ESD, contamination control, and cleanroom standards. Strong execution‑focused leadership with operational rigor. Ability to manage high‑mix, high‑volume, and time‑critical environments. Financial acumen for inventory, cost, and capacity optimization. Relevant education and experience may be substituted as appropriate. Hard Skills wafer lot starts WIP control cleanroom operations gown room operations FAB material flow Lean Six Sigma SPC root cause analysis cycle time analysis Soft Skills execution‑focused leadership operational rigor ability to manage high‑mix environments ability to manage high‑volume environments financial acumen #J-18808-Ljbffr Jobtailor