Senior IC Package Layout Engineer - 2.5D/3D-IC
Jobleads-US
Annapurna Labs, within AWS, is seeking a Package Layout Design Engineer to design advanced IC packages for ML and data center ASICs. You will drive layout tasks from floor planning through tape-out, collaborating with senior engineers, SI/PI, thermal, and manufacturing teams to meet performance and reliability goals.
Experience with 2.5D/3D packaging, RDL/substrate routing, and DFM/DRC is essential. Strong communication and tooling skills (Cadence APD/SiP, Synopsys IC Packaging, Mentor
#J-18808-Ljbffr Jobleads-USVacancy posted 1 day ago
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