Principal Package Design Engineer

Responsibilities

• Develop hermetic, ceramic, metal, radiation-tolerant, and Class P plastic package technologies and interconnect methods for commercial space, aerospace, and high-reliability power applications.
• Define package technology requirements, tooling needs, process flows, and qualification plans for new and existing package platforms.
• Benchmark, select, and qualify materials, assembly processes, and subcontractors, including OSAT partners and Renesas' in-house Palm Bay assembly site.
• Partner with Renesas product design teams to develop detailed package drawings for hermetic and plastic packages using AutoCAD.
• Work with OSAT partners and internal manufacturing teams to run DOE activities, optimize assembly processes, and establish process specifications.
• Collaborate with product engineering, program management, and reliability teams to qualify new packages and processes within required project schedules.
• Maintain technical expertise on advances in hermetic, ceramic, metal, radiation-tolerant, and Class P plastic packaging technologies.
• Participate in packaging roadmap development, with a focus on execution, manufacturability, reliability, and long-term package strategy.

Qualifications

• 10+ years of relevant experience in semiconductor package development, with emphasis on hermetic, ceramic, metal, radiation-tolerant, or Class P plastic packaging.
• Experience with semiconductor IC assembly processes, materials, package technologies, and package qualification.
• Familiarity with high-reliability, aerospace, commercial space, or defense-related semiconductor packaging requirements.
• Experience working with external package suppliers, OSAT partners, or internal assembly/manufacturing sites.
• Knowledge of AutoCAD and Microsoft Office tools, including Excel, PowerPoint, and Word.
• Strong communication, analytical, presentation, and cross-functional collaboration skills.
• Familiarity with MIL-STD-883, MIL-PRF-38535, and MIL-STD-750 standards.

Education

• Bachelor's, Master's, or Doctorate degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related technical field.
• Masters Preferred

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world-leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.