Senior 3D/2.5D Heterogeneous Packaging Engineer
Jobleads-US
GlobalFoundries is seeking a senior engineer for chiplet-based 2.5D/3D integration across silicon, glass and mold interposers, including embedded silicon bridges. You will own end-to-end integration and work with fabrication, design, and reliability teams.
The role emphasizes leadership, innovation, and collaboration with external partners to advance heterogeneous integration capabilities for multiple programs. Requires 10+ years of related experience and an MS degree.
#J-18808-Ljbffr Jobleads-USVacancy posted 2 days ago
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