PMTS Photonics Packaging Design Integration

About GlobalFoundries: GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. Our Advanced Packaging and Photonics Center (APPC) is at the forefront of enabling next-generation optical interconnects and heterogeneous integration (HI) for AI, HPC, and data center applications. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit

Summary of Role

As a Photonic Packaging Design Integration Engineer within GF’s APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design. Focus on product and module performance, reliability packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches.

Essential Responsibilities

• Drives SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
• Support new customer products with innovative design solutions and technology design rules.
• Drives design reviews with cross functional teams.
• Drives cross function teams to resolve technical & yield concerns.
• Develops engineers skills in packaging design constraints and considerations.
• Develops complex analysis models to predict for manufacturability, cost, and quality.
• Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
• Drives discipline and qualification robustness through a consistent global design processes.
• Drive CIP (Continuous improvement plans) to deliver organizational goals.
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Other Responsibilities

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications

• MS +20, or PhD + 15 or more years of experience.
• Experience in bringing packaged products from development into production.
• Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
• Advanced packaging design and layout expertise.
• Strong written and spoken English communication skills.

Preferred Qualifications

• Materials science, thermal, mechanical, simulation background.
• Experience with failure analysis, design of experiments, & packaging process integration.
• Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
• Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
• Experiment Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.

Expected Salary Range $131,900.00 - $241,500.00 The exact Salary will be determined based on qualifications, experience and location.

If you need a reasonable accommodation for any part of the employment process, please contact us by email at View email address on click.appcast.io and let us know the nature of your request and your contact information. Requests for accommodation will be considered on a case-by-case basis. Please note that only inquiries concerning a request for reasonable accommodation will be responded to from this email address.

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