3D Packaging & Simulation Intern (Hybrid)
Intel Corporation
Intel Corporation is seeking an Advanced Packaging Integration and Simulation Intern in the United States. The internship focuses on 2.5D/3D integration, chiplet architectures, and wafer-level packaging with emphasis on DOE and data-driven methods. You will collaborate with researchers and engineers to develop and validate package models, perform thermo-mechanical simulations, and present findings in technical reviews and potential publications. #J-18808-Ljbffr Intel Corporation
Vacancy posted 3 days ago
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